The Influence of Surface Roughness on Diffusion Bonding of High Nb Containing TiAl Alloy

Zhu, Lixia; Xue, Xu; Tang, Bin; Kou, Hongchao; Li, Jinshan

doi:10.2991/ame-16.2016.106

Cited by 5 publications

(3 citation statements)

References 14 publications

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“…Similarly, Lili Cao et al demonstrated that the amount of ordered nanoparticles reduced as the contact angle of the hydrophobic surface increased [ 3 ]. Surface roughness is important for enhancing the quality of diffusion bonding joints, according to Zhulei et al [ 35 ]. Additionally, as demonstrated by Frederic [ 36 ], surface roughness enhances the quantity of contacts between the substrate and the atoms of the metal layer.…”

Section: Resultsmentioning

confidence: 99%

Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment

Yang

Gao

et al. 2023

Materials

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A non-thermal atmospheric jet plasma pre-treatment technique was introduced to help the growth of extremely sticky copper films on fused silica glass substrates. A tape test was utilized to assess the bonding quality between copper films and fused silica glass substrates. AFM was used to characterize the sample surface roughness and XPS for chemical bonding characterization. The Owens–Wendt method and a Theta Lite Optical Tensiometer were used to analyze the contact angle and surface energy. The results showed that the surface energy greatly increased from 34.6 ± 0.3 mJ·m−2 to 55.9 ± 0.4 mJ·m−2 after 25 s plasma pre-treatment due to the increasing Si-O and Si-N concentrations, which brought about the electrostatic force increasing at the copper/glass interface. After 25 s plasma pre-treatment, the average surface roughness (Sa) grew from 0.8 ± 0.1 nm to 2.4 ± 0.3 nm. With higher surface roughness, there were more spaces and vacancies for the copper atoms to make contact on the bonded surfaces and increase the mechanical bite force. The electrostatic force and the mechanical bite force on the interface helped to form an atomic diffusion connection layer and improved the interactions between the copper film and the glass substrate. The findings in the SEM supported the conclusions stated above. Therefore, the adhesion between copper films and fused silica glass substrates increased by about 20% by 25 s plasma pre-treatment compared with the untreated glass substrate.

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Section: Resultsmentioning

confidence: 99%

Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment

Yang

Gao

et al. 2023

Materials

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“…Brushed surfaces lead to quality bonds due to a high recrystallisation effect and enhanced interfacial diffusion by an increased dislocation density. However, Zhu et al [72] reported opposite results after DB of high niobium containing Ti–Al alloy. It was reported that with a higher level of roughness, white layer α2 (Ti3Al) appears, which decreases the shear strength of bonds.…”

Section: Diffusion Bondingmentioning

confidence: 99%

Effect of surface oxide layers in solid-state welding of aluminium alloys – review

Zlatanović

Bergmann

Baloš

et al. 2023

Science and Technology of Welding and Joining

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This review sheds novel insights on the residual oxide behaviour of solid-state weld joints of aluminium alloys. Understanding the influence of oxides on the aluminium surface before and during welding, its impact on the weld structure and possible solutions for reducing its impact were addressed. The solid-state techniques most relevant to the transportation sector namely, diffusion bonding, friction stir spot welding and ultrasonic welding were surveyed, analysed and reviewed. During this analysis, the implication of the presence of oxides on aluminium substrate affecting the metallurgical characteristics of the weld joints was reviewed. Visible defects such as voids, delamination, kissing bond and hook defects, and problems associated with these defects were analysed and few suggestions are made to partially overcome these issues.

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“…A surface roughness of 0.84 µm produced a maximum ultimate tensile strength (UTS) value of ~130 MPa, while a surface roughness of 0.18 µm produced a UTS value of ~80 MPa for the bonding of aluminum alloys. On the other hand, tensile strength and joint efficiency were improved with a smoother surface finish [84,85]. The tensile strength of the joint of a Cu-Cu (copper-copper) couple was found to be ~50 MPa and ~5 MPa for surface roughnesses of 90 nm and 1.5 µm, respectively, for a bonding temperature of 400 • C and 20 min bonding time.…”

Section: Other Diffusion Parametersmentioning

confidence: 99%

Evaluation of Tungsten—Steel Solid-State Bonding: Options and the Role of CALPHAD to Screen Diffusion Bonding Interlayers

Robin

Gräning

Yang

et al. 2023

Metals

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Critical aspects of innovative design in engineering disciplines like infrastructure, transportation, and medical applications require the joining of dissimilar materials. This study investigates the literature on solid-state bonding techniques, with a particular focus on diffusion bonding, as an effective method for establishing engineering bonds. Welding and brazing, while widely used, may pose challenges when joining materials with large differences in melting temperature and can lead to mechanical property degradation. In contrast, diffusion bonding offers a lower temperature process that relies on solid-state interactions to develop bond strength. The joining of tungsten and steel, especially for fusion reactors, presents a unique challenge due to the significant disparity in melting temperatures and the propensity to form brittle intermetallics. Here, diffusion characteristics of tungsten–steel interfaces are examined and the influence of bonding parameters on mechanical properties are investigated. Additionally, CALPHAD modeling is employed to explore joining parameters, thermal stability, and diffusion kinetics. The insights from this research can be extended to join numerous dissimilar materials for specific applications such as aerospace, automobile industry, power plants, etc., enabling advanced and robust design with high efficiency.

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The Influence of Surface Roughness on Diffusion Bonding of High Nb Containing TiAl Alloy

Cited by 5 publications

References 14 publications

Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment

Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment

Effect of surface oxide layers in solid-state welding of aluminium alloys – review

Evaluation of Tungsten—Steel Solid-State Bonding: Options and the Role of CALPHAD to Screen Diffusion Bonding Interlayers

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