Abstract:A non-thermal atmospheric jet plasma pre-treatment technique was introduced to help the growth of extremely sticky copper films on fused silica glass substrates. A tape test was utilized to assess the bonding quality between copper films and fused silica glass substrates. AFM was used to characterize the sample surface roughness and XPS for chemical bonding characterization. The Owens–Wendt method and a Theta Lite Optical Tensiometer were used to analyze the contact angle and surface energy. The results showed… Show more
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