The characteristics of
normalGaAs
anodization at constant applied voltage, V, in a concentrated (30%)
H2O2
electrolyte are examined in detail. Uniform oxides, with a refractive index of 1.8 and oxide thickness, t, proportional to V, are grown over the pH range 1–6. The pH can be adjusted by the addition of
NH4OH
or
H3PO4
to the electrolyte but the presence of other common acids at concentrations of a few parts per million can transform the anodization process into an etching procedure. In 10 min anodizations at
pH=2,18Aå;/V
of oxide are grown and
12Aå/Vnormalof GaAs
are consumed on chemically polished surfaces (for
V≤225V
). The resistance of the electrolyte causes significant voltage drops in the electrolyte at all pH values and limits the initial current flow. Most of the oxide is grown during the initial anodization (typically in the first minute) where the current is decreasing rapidly with time and the voltage drop across the oxide is increasing. The oxide is insoluble in the
HNO3
but is soluble in most other acids and bases. Limited MOS measurements yield a dielectric constant of 5.4 and a breakdown field of
3×106V/normalcm
. The use of the oxide as a mask for chemical etching was demonstrated by forming passive optical waveguides in
normalGaAlAs‐normalGaAs‐normalGaAlAs
epitaxial layers.