The Implementation of Total Quality Management in Order to Improve Production Performance and Enhancing the Level of Customer Satisfaction

Topalović, Snežana

doi:10.1016/j.protcy.2015.02.145

Cited by 48 publications

(52 citation statements)

References 21 publications

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“…As a result of its focus on quality, the TQM methodology helps leaders create efficient processes for operation and increase their organization's competitiveness . Senior leaders need to provide support and commitment to PI teams for TQM or any improvement methodology to be successful …”

Section: Total Quality Managementmentioning

confidence: 99%

A Practical Guide to Performance Improvement: Implementation of Systematic Methodologies

Dawson¹

2019

AORN Journal

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This article discusses performance improvement (PI) and the various methods that PI teams can use to provide a framework for improvement. Teams that complete successful PI projects use a systematic methodology that guides them through the process in a step‐by‐step manner, with each step building upon the previous one using data collection methods and analytics. Personnel involved with PI projects may need to use various methodologies to achieve improvement. These tools range from Plan‐Do‐Study‐Act cycles to more complex methods such as Six Sigma, which uses a define, measure, analyze, improve, and control process as its foundation. This article includes examples of how PI project team members can implement various methodologies and analysis tools to improve processes across the PI project continuum. After reviewing this article, the reader should have a better understanding of the systematic methodologies supporting the PI process. This is the third article of a six‐part series about performance improvement.

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Section: Total Quality Managementmentioning

confidence: 99%

A Practical Guide to Performance Improvement: Implementation of Systematic Methodologies

Dawson¹

2019

AORN Journal

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“…It means that an outcome must not deviate from the specifications set by an organisation, and any deviations are considered as lowering the quality (Reeves & Bednar, 1994). Such conformance measures have been argued to increase the internal efficiency of the process and sale prices over time (Topalovic, 2015). Later, as the focus shifted from manufacturers to customers, a new definition of "quality" emerged, i.e.…”

Section: Literature Reviewmentioning

confidence: 99%

Reduction of defects in the lapping process of the silicon wafer manufacturing: the Six Sigma application

Sharma

Sahni

Sharma

2019

Engineering Management in Production and Services

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A B S T R A C T Aiming to reduce flatness (Total Thickness Variation, TTV) defects in the lapping process of the silicon wafer manufacturing, it is crucial to understand and eliminate the root cause(s). Financial losses resulting from TTV defects make the lapping process unsustainable. DMAIC (Define, Measure, Analyse, Improve and Control), which is a Six Sigma methodology, was implemented to improve the quality of the silicon wafer manufacturing process. The study design and the choice of procedures were contingent on customer requirements and customised to ensure maximum satisfaction; which is the underlying principle of the rigorous, statistical technique of Six Sigma. Previously unknown causes of high TTV reject rates were identified, and a massive reduction in the TTV reject rate was achieved (from 4.43% to 0.02%). Also, the lapping process capability (Ppk) increased to 3.87 (beyond the required standard of 1.67), suggesting sustainable long-term stability. Control procedures were also effectively implemented using the techniques of poka yoke and control charts. This paper explores the utility of Six Sigma, a quality management technique, to improve the quality of a process used in the semiconductor industry. The application of the Six Sigma methodology in the current project provides an example of the root cause investigation methodology that can be adopted for similar processes or industries. Some of the statistical tools and techniques were used for the first time in this project, thereby providing new analysis and quality improvement platform for the future. The article offers a deeper understanding of the factors that impact on the silicon wafer flatness in the lapping process. It also highlights the benefits of using a structured problem-solving methodology like Six Sigma. K E Y W O R D SSix Sigma, quality, silicon wafer, lapping, quality control, total thickness variation, wafer manufacturing

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“…2) Profit Loss Analysis; At this stage it begins with the dissemination and completion of a questionnaire containing questions about the order of priority level criteria and choosing the level of importance based on the level of priority that has been selected. The order of priority level of this criterion is used to determine the criteria weights used in the evaluation matrix analysis phase [7], [17]. 3) Pairwise Comparative Assessment; Pairwise comparison is done on elements at a hierarchical level.…”

Section: Steps Of Analysis Hierarchy Processmentioning

confidence: 99%

Application of Taguchi and Analysis Hierarcy Process Methods for Furan Design on Metal Casting Industry

Hasibuan¹,

Parinduri²,

Sulaiman³

et al. 2018

IJET

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In the preparation of furan the raw material used are, Silica Sand, Resin, and Catalyst. Some problem that occurs are high level of water, high level of sour, high level of clay, unsuitable distribution, and low permeability. All those problems above make the power of furan not suitable with the target that has been stated, so that furan can easily be broken, cracked, and do not stand with high temperature and its power becomes weak. The result of this research is that the optimal combination based on the highest TOPSIS score is A1 B2 C3 with the composition of Resin 1.3%, Catalyst 22.5% and new sand 15% + reclaim sand 85%. The coefficient of loss function compression strength is 4.611,11 and 10.375 for the shear strength. The raising quality based on the confirmation experiment is 0.1018 for the compression strength and 0.2339 for the shear strength. The value of S/N in the confirmation experiment for the compression strength is 20.5817 and 23.0480, in which both numbers are in the trust interval limitation that has been decided. It shows that TOPSIS procedure is able to increase furan quality for both responses, that is compression strength response, and shear strength response all at once in one parameter setting.

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The Implementation of Total Quality Management in Order to Improve Production Performance and Enhancing the Level of Customer Satisfaction

Cited by 48 publications

References 21 publications

A Practical Guide to Performance Improvement: Implementation of Systematic Methodologies

A Practical Guide to Performance Improvement: Implementation of Systematic Methodologies

Reduction of defects in the lapping process of the silicon wafer manufacturing: the Six Sigma application

Application of Taguchi and Analysis Hierarcy Process Methods for Furan Design on Metal Casting Industry

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