The impact of moisture in mold compound preforms on the warpage of PBGA packages

Lin, Tingyu; Njoman, B.; Crouthamel, D. L.; Chua, K.H.; Teo, S.Y.; Ma, Yi

doi:10.1016/j.microrel.2003.08.003

Cited by 28 publications

(5 citation statements)

References 17 publications

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“…Combined TMA/TGA techniques are widely used for analyzing the moisture behaviors of pure materials [6][7][8][9]. However it is not a simple task to obtain precisely the same materials used in the components to be analyzed.…”

Section: Fig 1 Configuration Of Pop [1]mentioning

confidence: 99%

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Moisture induced effects in PoP

Guédon-Gracia

Feng

Delétage

et al. 2009

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelect

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This paper presents a combined numerical and experimental methodology for predicting moistureinduced effects in Package-on-Package (PoP) assemblies. The hygroscopic warpage of the assembly "PoP" is measured. Its behavior is compared with the individual components "top" and "bottom". The assembly "PoP" absorbs more moisture than the sum of the two individual components, while deforms less than either of the two individual components, which holds much more constrain inside the assembly. In addition, the hygroscopic warpage (20µm) adds to the thermal warpage (30µm) for the assembly "PoP", which might lead to more serious reliability problem. Furthermore, a new experimental methodology for prediction of the moisture-induced warpage is validated, and simulation models match the experimental results.

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Section: Fig 1 Configuration Of Pop [1]mentioning

confidence: 99%

“…Fig. 7 Definition of the warpage shapes [8] When the component deforms in the "smile" shape, the warpage is considered as positive, while negative for the "frown" shape. Then the "twist" warp means warpage was inconsistently "smile" or "frown", some corners of package surface could be "up" or "down".…”

mentioning

confidence: 99%

Moisture induced effects in PoP

Guédon-Gracia

Feng

Delétage

et al. 2009

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelect

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“…The shadow-Moiré method is a non-contact method based on the geometric interference of a shadow grating projected on the warped sample surface, and a real grating projected on a fl at reference surface [3][4][5]. Improvements in the shadow-Moiré technique offer higher sensitivity and increase in dynamic range of warpage measurements [5].…”

Section: Non-destructive Evaluationmentioning

confidence: 99%

Defect and Failure Analysis Techniques for Encapsulated Microelectronics

Ardebili

Pecht

2009

Encapsulation Technologies for Electronic Applications

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“…Plastic packaging is relatively cheap, but it always suffers from stress due to the hygroscopic swelling mismatch and CTE (Coefficient of Thermal Expansion) mismatch between different materials in the packaging structure [1][2]. In addition, requirements from higher density product introduce failure and reliability issues on plastic packaging so that the packaging structure designs become more and more critical.…”

Section: Introductionmentioning

confidence: 99%

In-situ reliability monitoring on PBGA packaging through piezoresistive stress sensor

Chang

Chung

Lwo

et al. 2010

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

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It is well known that the CTE mismatch and the hygroscopic swelling mismatch in a plastic packaging lead reliability issues so that a suitable extraction methodology on packaging stress and failure parameters are needed. To this end, we first designed and made the piezoresistive stress sensors for packaging stress measurements and performed the sensor calibrations. Test chips were next packaged into a typical plastic packaging and the hygroscopic stress were measured. Finally, a reliability test was performed to extract the long-term effects and the reliability parameters. It is concluded from the works that the hygroscopic mismatch stress is about 50 MPa and it is significant for the packaging. It is also concluded that the Weibull reliability model is suitable for the PBGA packaging, and the Weibull parameters were successfully extracted.

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The impact of moisture in mold compound preforms on the warpage of PBGA packages

Cited by 28 publications

References 17 publications

Moisture induced effects in PoP

Moisture induced effects in PoP

Defect and Failure Analysis Techniques for Encapsulated Microelectronics

In-situ reliability monitoring on PBGA packaging through piezoresistive stress sensor

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