1999
DOI: 10.1016/s1359-8368(99)00038-4
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The hardnesses and elastic moduli of pulsed laser deposited multilayer AlN/TiN thin films

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Cited by 42 publications
(12 citation statements)
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“…The hardness values for crystalline AlN deposited on Si (111) are reported to be around 20 GPa [33], and in some cases even in the range 24-25 GPa [15]. For the as-deposited state, all Al-N+Au coatings presented hardness values between 15 and 24 GPa, in good agreement with results from the literature (figure 12a)).…”
Section: Accepted M Manuscriptsupporting
confidence: 86%
See 1 more Smart Citation
“…The hardness values for crystalline AlN deposited on Si (111) are reported to be around 20 GPa [33], and in some cases even in the range 24-25 GPa [15]. For the as-deposited state, all Al-N+Au coatings presented hardness values between 15 and 24 GPa, in good agreement with results from the literature (figure 12a)).…”
Section: Accepted M Manuscriptsupporting
confidence: 86%
“…AlN prefers to grow with closed-packed planes aligned normally to the growth direction [15]. It has been reported that AlN films shows (100) preferred orientation at low nitrogen concentration and, with the increase of this parameter, the films tends out to be more randomly orientated, leading finally to c-axis (002) oriented films with further increasing in the nitrogen concentration [16].…”
Section: Structure and Microstructure Of The Coatingsmentioning
confidence: 99%
“…The material hardness is depended on many factors such as interatomic bond lengths, the degree of covalent bonding, the temperature, the microstructure and the deformation mechanism [30,31]. As the microstructure and the deformation mechanism were different for TiC, Ti(C,N) single layer coatings and TiN/TiC multilayer coatings, the changes in the hardness of theses coatings with the same crystal structure was predictable.…”
Section: Hardnessmentioning
confidence: 99%
“…The CTEs of Al-diamond composites obtained in the present study are 12.5 and 10.4 Â 10 À6 /K at 40 vol.% diamond and 50 vol.% diamond, respectively. On the other hand, some packaging base materials currently in use are Cu-W, AlN and BeO, and their CTEs are 4-8 Â 10 À6 /K [4][5][6]. To apply Al-diamond composites as a heat spreader, it is necessary to add more diamond powders to such composites.…”
Section: Coefficients Of Thermal Expansionmentioning
confidence: 99%
“…Packaging base materials well known are Cu-W [4], AlN [5], BeO [6] and Al/SiC [7] composites and these all have thermal conductivities, k, near 200 W/mK. The highest thermal conductivity material is good quality diamond, that is available as a naturally occurring material and contains nitrogen less than 100 ppm, and the thermal conductivity, k, is around 2000 W/mK [8].…”
Section: Introductionmentioning
confidence: 99%