The growth and characterization of photonic thin films

Grant, John T.; Jiang, Hao; Tullis, S.; Johnson, Walter; Eyink, Kurt G.; Fleitz, Paul A.; Bunning, Timothy J.

doi:10.1016/j.vacuum.2005.07.022

Cited by 17 publications

(15 citation statements)

References 19 publications

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“…This amount of oxygen present in the film is in-keeping with the findings of Elders et al [3], who typically found that a plasma deposited fluoropolymer film contains somewhere in the region of 1e10% oxygen. The shape of the C 1s photoelectron spectra resembles those published by Amyot et al [4], Jiang et al [12] and Grant et al [9], with the principal peaks in the C 1s photoelectron spectra for all CF x O y films attributed to photoelectrons from the CeF and CeF 2 bonds in the films. The remainder of the spectra consists of photoelectrons from the CeF 3 , CeCF and CeC bonds.…”

Section: Characterisation Of Films 1e8supporting

confidence: 80%

“…Argyrakis et al [7] employed CF x O y thin films as an anti-adhesion and structure release aide. Grant et al [8,9] examined the growth and structure of CF x O y thin films as a function of the C 4 F 8 gas inlet feed position relative to the plasma zone, while Ningel et al [10] characterised CF x O y thin films deposited onto substrates up to 250 mm in length, reporting that the films exhibited excellent surface homogeneity.…”

Section: Introductionmentioning

confidence: 99%

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Characteristics and durability of fluoropolymer thin films

Cheneler

Bowen

Evans

et al. 2011

Polymer Degradation and Stability

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Keywords:Fluoropolymer Ellipsometry Atomic force microscopy X-ray photoelectron spectroscopy Wetting Solvent Etchant Aqueous solution pH Q1 a b s t r a c tThe use of plasma-polymerised fluoropolymer (CF x O y ) thin films in the manufacture of microelectromechanical systems (MEMS) devices is well-established, being employed in the passivation step of the deep reactive ion etching (DRIE) process, for example. This paper presents an investigation of the effect of exposure to organic and aqueous liquid media on plasma-polymerised CF x O y thin films. Atomic force microscopy (AFM), scanning electron microscopy (SEM), ellipsometry, X-ray photoelectron spectroscopy (XPS) and dynamic wetting measurements were all employed as characterisation techniques. Highly basic aqueous solutions, including known silicon etchants, were found to cause delamination via degradation of the countersurface below the CF x O y thin film. Films were found to be stable in organic solvents, acidic aqueous solutions and slightly basic aqueous solutions.

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Section: Characterisation Of Films 1e8supporting

confidence: 80%

Section: Introductionmentioning

confidence: 99%

Characteristics and durability of fluoropolymer thin films

Cheneler

Bowen

Evans

et al. 2011

Polymer Degradation and Stability

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“…This is important if the use of cantilevers in arrays is to be exploited. [22] Comparison with the best sensitivity and response parameters for existing designs from other cantilevers with plasmapolymerized coatings, acoustic wave sensors, and recently reported silicon nanowires shows that the detection precision of our design is about one order of magnitude better, response time is at least two orders of magnitude faster, and selectivity is two orders of magnitude better than those reported in the literature (Tab. 1).…”

Section: Adv Mater 2007 19 4248-4255mentioning

confidence: 80%

Polymer–Silicon Flexible Structures for Fast Chemical Vapor Detection

et al. 2007

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Although there are several aspects that contribute to an efficient chemical sensor system, the choice of responsive materials can help to optimize several key attributes critical for their ultimate performance, specifically high sensitivity, selectivity, fast response time, and wide dynamic range. Some common issues reported to date for sensors are limited detection range, slow response time, long recovery period, and fast saturation (limited dynamic range).[1] Most of these issues are directly related to the large volume of bulk porous material that is needed for measurable signal output, which leads to inherently slow sorption, diffusion, and desorption processes. One type of gas sensor that receives only limited attention despite being among the most frequently used sensors for measuring important environmental quantities is the humidity sensor.[2]Important applications of this type of sensor include for respiratory equipment, incubators, chemical gas purification, and surgical operations. The main requirements for humidity sensors are good sensitivity over a wide humidity range, low hysteresis, good reproducibility, and longevity. [2,3] Often sensors are required to be very small and suitable for integration into arrayed systems, such as odor-sensing arrays. Humidity sensors currently tend to exploit the characteristics of bulk materials with the required resistive and capacitive response properties. This type of sensor comprises a moisture sensitive ceramic, metal, or polymer material that undergoes changes in resistance or capacitance with variations in ambient humidity. [3,4] Water vapor sensors that use polymeric materials commonly incorporate polyimides, polycarbonates, cellulose acetates, or conductive polymers. [5,6] The typical vapor sensitivity of such sensors is of the order of tens of parts per million (or ±0.05 % relative humidity, RH), which is sufficient for most routine measurements. However, this is not acceptable if a fast, real-time monitoring of vapor content variation is required. Increased sensitivity, to a low ppm level, can be achieved using a porous material to maximize the specific surface area available for water vapor adsorption. [7][8][9] For example, 0.4 ppm v (parts per million by volume) water vapor detection was demonstrated by Salonen et al. using carbonized porous silicon.[9] Bruno et al. used a polymer-coated resonant device to obtain a sensitivity of 7 ppm v .[10] In these cases, although the sensors reported showed good sensitivity they suffered sluggish response times, often requiring a few minutes to completely recover. Currently, modest sensitivity and slow response are the main obstacles to the design and development of microcantilever-based sensor technology. [11,12] In this Communication, we present a bimaterial design for humidity sensing with a vapor-sensitive plasma-polymerized nanolayer coating on a silicon microcantilever with a low flexural rigidity (Fig. 1a,d). The coating acts as a sensitive mechanical actuator, which mediates high internal stresses, enabling...

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“…PECVD allows for a number of surface chemistries, as nontraditional monomers with widely varying functionalities can be plasma polymerized onto numerous substrate surfaces, including both organic and inorganic substrates. [22][23][24] These varying chemistries enable surface-functionality tailoring for specific molecular site binding that may not otherwise be achievable. Moreover, a minimal number of fabrication steps are required via PECVD, as devices can be fabricated in as few as two steps, involving initial surface treatment followed by pattern deposition.…”

mentioning

confidence: 99%

Site‐Specific Patterning of Biomolecules and Quantum Dots on Functionalized Surfaces Generated by Plasma‐Enhanced Chemical Vapor Deposition

et al. 2006

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Plasma‐enhanced chemical vapor patterned surfaces are used for site‐ specific attachment of biomolecules and semiconductor quantum dots (QDs; see figure). The fabrication of surfaces with multiple functional building blocks can be used in a single step to create complex multifunctional patterned substrates incorporating self‐assembled monolayers (SAMs) and thiol‐functionalized quantum dots for a variety of applications.

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The growth and characterization of photonic thin films

Cited by 17 publications

References 19 publications

Characteristics and durability of fluoropolymer thin films

Characteristics and durability of fluoropolymer thin films

Polymer–Silicon Flexible Structures for Fast Chemical Vapor Detection

Site‐Specific Patterning of Biomolecules and Quantum Dots on Functionalized Surfaces Generated by Plasma‐Enhanced Chemical Vapor Deposition

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