2006
DOI: 10.1088/0268-1242/21/6/016
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The formation of trench-gate power MOSFETs with a SiGe channel region

Abstract: The fabrication of trench-gate power MOSFETs with a SiGe channel region has been proposed to further improve the device performance. A larger Ge mole fraction of Si 1−x Ge x may cause a smaller on-state resistance but more degradation of the blocking voltage. A proper Ge mole fraction of 0.2 may be available, implementing a device with a blocking voltage of 30 V and a specific on-state resistance of about 0.70 cm. On the other hand, a gradually changed Ge mole fraction of the Si 1−x Ge x channel region may be … Show more

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Cited by 15 publications
(13 citation statements)
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“…For example, lightly-doped-drain (LDD) implantation is required on polycrystalline-Si TFT to reduce the off current of the TFT which causes severe vertical crosstalk in the display. This involves expensive ion implantation and large number of mask sets for TFT fabrication compared to LCD [11], and it also still needs simpler process and architecture. In conclusion, in order to succeed in the driving AMOLED from research to development, we have to adopt a route that makes a TFT having a performance of poly-crystalline Si TFT with a conventional a-Si TFT process.…”
Section: Results and Discussion 21 Tft Backplane Developmentmentioning
confidence: 99%
“…For example, lightly-doped-drain (LDD) implantation is required on polycrystalline-Si TFT to reduce the off current of the TFT which causes severe vertical crosstalk in the display. This involves expensive ion implantation and large number of mask sets for TFT fabrication compared to LCD [11], and it also still needs simpler process and architecture. In conclusion, in order to succeed in the driving AMOLED from research to development, we have to adopt a route that makes a TFT having a performance of poly-crystalline Si TFT with a conventional a-Si TFT process.…”
Section: Results and Discussion 21 Tft Backplane Developmentmentioning
confidence: 99%
“…To accurately reproduce the behavior of the trench MOSFETs in real circuit operation, we have carefully chosen the physical models and model parameters used in Spice simulation, such as carrier mobility and lifetime. The trench MOSFET model was validated by comparing to measurement data of real devices [5].…”
Section: Modeling Of Basic Trench Power Mosfetmentioning
confidence: 99%
“…For example, UMOSFET (SiGe) is a UMOSFET with SiGe-channel. The basic models of SiGeC material had been researched in a reported paper [9]. Here, the additional remarks about SiGeC are included as belo\v.…”
Section: Device Structure and Geometrymentioning
confidence: 99%