The formation of carbonic and silicon dioxide structured films through the decomposition of molecules on the surface of ionic crystals under the action of IR femtosecond laser radiation

Abstract

This study relates to the formation of carbon and silicon dioxide films that occurs as a result of the decomposition of organic and silicon-containing molecules on the surface of ionic crystals under IR femtosecond laser radiation of moderate intensity (~10 11 W cm −2 ) without molecular decomposition in the gas phase. We found that transparent graphite oxide films formed in the case of CO 2 molecule decomposition.

IR femtochemistry on the surface of wide-gap ionic crystals

“…In total, 12 organic and silicon-containing electronic grade compounds were studied in our experiments [10][11][12]. The compounds belong to different classes: aromatic compounds, ketones, alcohols, halogen-substituted methanes and others.…”

“…It was shown that deep fragmentation of molecules up to elemental carbon or silicon occurs in the layer adsorbed on the polished surface of wide-gap ionic crystals (LiF, CaF 2 , BaF 2 ) at a relatively low intensity (~10 11 W cm −2 ) and fluence (30-90 mJ cm −2 ) of femtosecond pulses. In the gas phase, when the radiation intensity was an order of magnitude higher (>10 12 W cm −2 ), no dissociation of molecules was observed. Films grew under infrared irradiation at frequencies that could be either resonant or nonresonant to some molecular vibrations.…”

“…Previously, we found and studied the effect of formation of microstructured carbon and silicon oxide films that result from decomposition of organic and silicon-containing molecules under the action of IR femtosecond laser radiation at a wavelength of 3.3-5.4 µm [10][11][12]. It was shown that deep fragmentation of molecules up to elemental carbon or silicon occurs in the layer adsorbed on the polished surface of wide-gap ionic crystals (LiF, CaF 2 , BaF 2 ) at a relatively low intensity (~10 11 W cm −2 ) and fluence (30-90 mJ cm −2 ) of femtosecond pulses.…”

Исследование Влияния Поверхностного Упрочнения На Локальные Механические Свойства Режущей Кромки Обрабатывающего Инструмента

“…With the advent of cheap, reliable and energy efficient lasers, their industrial use is constantly growing [1]. Laser-based tools are used in cutting, welding, surfacing, alloying, drilling and brazing [2][3][4]. These processes can be carried out on areas ranging from a millimeter to a micron, depending on the type, power, gas medium, and operating mode of the laser [5][6][7][8][9].…”

“…С появлением дешевых, надежных и энергоэффективных лазеров их применение в промышленности постоянно растет [1]. Инструменты на основе лазеров используются при резке, сварке, наплавке, легировании, сверлении и пайке [2][3][4]. Данные процессы можно проводить на областях в масштабе от миллиметрового до микронного размера, в зависимости от типа, мощности, газовой среды и режима работы лазера [5][6][7][8][9].…”