The fabrication of composite solder by addition of copper nano powder into Sn-3.5Ag solder

Abstract

Copper nano powder was incorporated into Sn-3.5Ag solder at 3wt%, by mechanically alloyed (MA) by ball milling in a planetary ball mill at room temperature. The rotation speed was kept constant at 150 rpm with different milling time, 26 hours, 78 hours and 120 hours. The milled solder was mixed with flux and reflowed at 240°C for 60 seconds. XRD result confirmed the formation of Cu 3 Sn after 120 hours of milling time. The melting temperature of the samples decreased as a function of milling time. The wetting angle was improved by 48% for the composite solder Sn-3.5Ag-nano-3.0Cu for 120 hours ball milled, compared to the Sn3.5Ag solder. Increased of hardness was obtained as a result of incorporation of nanoparticle.

Microstructural studies of ultrarapidly quenched foils of zinc-doped indium–tin eutectic alloys

“…In Europe, the waste electrical and electronic equipment (WEEE) directive by EU has banned the use of Pb in consumer goods, while the restriction of hazardous substances (ROHS) compliance has claimed that Pb is the most common material that must be eliminated [3].…”