The excess capacitance of a microstrip via in a dielectric substrate

Wang, T.; Mautz, Joseph R.; Harrington, Roger F.

doi:10.1109/43.45856

Cited by 26 publications

(4 citation statements)

References 8 publications

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“…A radius of is usually sufficient. The Green's function ( ) is the potential due to a ring of charge in the presence of a dielectric slab, and is given by (2) where (3) and if otherwise.…”

Section: Integral Equationsmentioning

confidence: 99%

“…Previous investigations have determined the excess capacitance and inductance of a via connecting two lines above the same ground plane [1] and the excess capacitance through a ground plane in a homogeneous medium [2]. In [3], the capacitance of a via through a thick ground plane is determined, and in [4] the analysis is extended to account for the connecting traces.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Rigorous and simplified models for the capacitance of a circularly symmetric via

Mathis

Peterson

Butler

1997

IEEE Trans. Microwave Theory Techn.

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An integral-equation method is presented for analyzing the capacitance of circularly symmetric vias with thick conductors and conical posts. From the numerical data, simple expressions are derived which account for the effect of conductor thickness and cone angle. Use of the approximate expressions allows one to accurately determine via capacitance while using a simpler thin-conductor straight-post via model.

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“…A radius of is usually sufficient. The Green's function ( ) is the potential due to a ring of charge in the presence of a dielectric slab, and is given by (2) where (3) and if otherwise.…”

Section: Integral Equationsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Rigorous and simplified models for the capacitance of a circularly symmetric via

Mathis

Peterson

Butler

1997

IEEE Trans. Microwave Theory Techn.

View full text Add to dashboard Cite

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“…In the early days, the quasi-static p type circuit model [2][3][4] consisting of two excess capacitances [5] and one excess inductance is used to describe the effect of a via hole in the reference plane. The value of the excess capacitance or the excess inductance can be solved by the method of moments (MOM) from the integral equations or the complete analytical method.…”

Section: Introductionmentioning

confidence: 99%

Novel hybrid analysis method for via structure in microwave multilayer circuits

Tian

Tong

2011

Int J Numerical Modelling

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SUMMARYA novel hybrid analysis method including physical modeling approach is presented for the single complete via structure in this paper. The via structure can be decomposed into two types of different sub-structures: the interior structure and the exterior structure. The characteristic of the interior structure consisting of the vertical via hole between reference planes is solved using the enhanced quasi-static method which takes into account the effect of parallel plates. The characteristic of the exterior structure is solved by the improved matrix-penciled fent method.Then the scattering parameters of the complete via structure can be obtained from the result of the exterior and the interior structure. In order to validate the correctness and the accuracy, the comparison results between the hybrid method and Ansoft's HFSS software are displayed for some microwave multilayer circuits with different layer numbers and different boundary conditions.

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“…The equivalent capacitance is calculated by the moment method. The effects on the equivalent capacitance of the substrate and finite thickness of the ground plane have been investigated. The FDTD method was used in Ref.…”

Section: Introductionmentioning

confidence: 99%

Circuit model and signal integrity analysis for multilayer printed circuit board interconnection

Kong

Sheng

et al. 2013

Int J RF and Microwave Comp Aid Eng

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A circuit modeling method and signal integrity analysis approach for multilayer printed circuit board interconnection based on the partial equivalent element circuit (PEEC) method is proposed. The multilayer interconnection structure is divided into a via hole and microstrip lines. A three-dimensional (3D) model of a via hole structure is constructed using the PEEC method with Rao-Wilton-Glisson (RWG) basis functions. The microstrip lines on the top and bottom layers are modeled by PEEC method with RWG basis functions and discrete complex image. The model order reduction method is used to analyze effectively the via hole structure. The equivalent circuit of the via hole structure is simplified, and its physical meaning is defined. The scattering (S) parameter obtained from the proposed method is consistent with simulation results, which are computed using the commercial 3D electromagnetic field analysis software FEKO. The correctness of the proposed method is validated. The S parameters of different dimensions are simulated, and the effects of these dimensions on the electromagnetic characteristics of the via hole structure are analyzed. The model of the entire structure is used to conduct eye diagram simulation.

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The excess capacitance of a microstrip via in a dielectric substrate

Cited by 26 publications

References 8 publications

Rigorous and simplified models for the capacitance of a circularly symmetric via

Rigorous and simplified models for the capacitance of a circularly symmetric via

Novel hybrid analysis method for via structure in microwave multilayer circuits

Circuit model and signal integrity analysis for multilayer printed circuit board interconnection

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