The energy balance at substrate surfaces during plasma processing

Kersten, Holger; Deutsch, Hans‐Peter; Steffen, H.; Kroesen, Gmw Gerrit; Hippler, R.

doi:10.1016/s0042-207x(01)00350-5

Cited by 324 publications

(262 citation statements)

References 99 publications

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“…etching, deposition of thin films, and surface modification. The thermal and energetic conditions at the substrate surface influenced by the different plasma species such as electrons, ions, and neutrals determine the elementary processes (adsorption, diffusion, chemical reactions) as well as the microstructure and stoichiometry of film growth [1,2]. The effect of energy per incoming particle and the particle flux is therefore essential in plasma processing of solid surfaces, particularly in the case of thin film growth [3,4,5,6].…”

Section: Introductionmentioning

confidence: 99%

Energy flux measurements in high power impulse magnetron sputtering

Lundin¹,

Stahl²,

Kersten³

et al. 2009

J. Phys. D: Appl. Phys.

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The total energy flux in a high power impulse magnetron sputtering (HiPIMS) plasma has been measured using thermal probes. Radial flux (parallel to the magnetron surface) as well as axial flux (perpendicular to the magnetron surface) were measured at different positions, and resulting energy flux profiles for the region between the magnetron and the substrate are presented. It was found that the substrate heating is reduced in the HiPIMS process compared to conventional direct current magnetron sputtering (DCMS) at the same average power. On the other hand, the energy flux per deposited particle is higher for HiPIMS compared to DCMS, when taking into account the lower deposition rate for pulsed sputtering. This is most likely due to the highly energetic species present in the HiPIMS plasma. Furthermore, the heating due to radial energy flux reached as much as 60 % of the axial energy flux, which is likely a result of the anomalous transport of charged species present in the HiPIMS discharge. Finally, the experimental results were compared to theoretical calculations on energy flux of charged species, and they were found to be in good agreement.

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Section: Introductionmentioning

confidence: 99%

Energy flux measurements in high power impulse magnetron sputtering

Lundin¹,

Stahl²,

Kersten³

et al. 2009

J. Phys. D: Appl. Phys.

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show abstract

“…This control over the generation of nanostructure material, transport to and interaction with the surface is enabled by careful modification of the plasma parameters such as power, pressure, gas composition, etc. as well as the external surface bias [128][129][130][131][132].…”

Section: Tailoring Metal Nanoarraysmentioning

confidence: 99%

Plasmas meet plasmonics

2012

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Abstract. The term 'plasmon' was first coined in 1956 to describe collective electronic oscillations in solids which were very similar to electronic oscillations/surface waves in a plasma discharge (effectively the same formulae can be used to describe the frequencies of these physical phenomena). Surface waves originating in a plasma were initially considered to be just a tool for basic research, until they were successfully used for the generation of large-area plasmas for nanoscale materials synthesis and processing. To demonstrate the synergies between 'plasmons' and 'plasmas', these large-area plasmas can be used to make plasmonic nanostructures which functionally enhance a range of emerging devices. The incorporation of plasmafabricated metal-based nanostructures into plasmonic devices is the missing link needed to bridge not only surface waves from traditional plasma physics and surface plasmons from optics, but also, more topically, macroscopic gaseous and nanoscale metal plasmas. This article first presents a brief review of surface waves and surface plasmons, then describe how these areas of research may be linked through Plasma Nanoscience showing, by closely looking at the essential physics as well as current and future applications, how everything old, is new, once again.

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“…For a quantitative description of particle heating in plasma environment the energy fluxes have to be measured either by calorimetric probes [2,48] or by suitable microparticle probes [44]. Based on probe theory for such test particles, a calorimetric balance model can be established where the particle temperature occurs as an observable.…”

Section: Particles In a Plasma Environment And The Measurement Of Thementioning

confidence: 99%

“…Here, the energetic conditions at the surface of a substrate in processes like sputtering, plasma etching, thin film deposition or surface modification are crucial for the improvement of applications with respect to morphology, stoichiometry and process rates [1][2][3][4][5]. Hence, monitoring and controlling the constitutional parameters like gas pressure and composition or substrate temperature is essential for the design of the process conditions.…”

Section: Introductionmentioning

confidence: 99%

On the heating of nano- and microparticles in process plasmas

Maurer¹,

Kersten²

2011

J. Phys. D: Appl. Phys.

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Determination and understanding of energy fluxes to nano-or microparticles, which are confined in process plasmas, is highly desirable because the energy balance results in an equilibrium particle temperature which may even initiate the crystallization of nanoparticles. A simple balance model has been used to estimate the energy fluxes between plasma and immersed particles on the basis of measured plasma parameters. Addition of molecular hydrogen to the argon plasma results in additional heating of the particles due to molecule recombination. The measured particle temperature is discussed with respect to appearing plasma-particle interactions which contribute to the particle's energy balance.

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The energy balance at substrate surfaces during plasma processing

Cited by 324 publications

References 99 publications

Energy flux measurements in high power impulse magnetron sputtering

Energy flux measurements in high power impulse magnetron sputtering

Plasmas meet plasmonics

On the heating of nano- and microparticles in process plasmas

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