The electrostatic-alloy bonding technique used in MEMS

Abstract

Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, and bonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors. The silicon wafer and glass wafer with an Au film resistor were bonded by electrostatic bonding, and then Si-Au alloy bonding was formed by annealing at 400˚C for 2 h. The air sealability of the cavity after bonding was finally tested using the N 2 filling method. The results indicate that large bond strength was obtained at the bonding interface. This process was used in fabricating a pressure sensor with a sandwich structure. The results indicate that the sensor presented better performances and that the bonding techniques can be used in MEMS packaging.

Modal Experiment and Analysis of HSK Tool-Holder and Thin-Disk Cutter

“…Therefore, it is necessary to deeply discuss and study the dynamic and static performance of the high-speed machining tool system. Compared with traditional BT tool-holder, HSK tool-holder has higher twisting resistance and coaxial accuracy [2,5], since its structural characteristics of the hollow thin-walled short axle and the combining ways of the over-constrained location between the cone and the end.…”