The electrochemical corrosion behavior of Pb–free Sn–8.5Zn–XCr solders in 3.5 wt.% NaCl solution

Liu, Moumiao; Yang, Wenchao; Ma, Yueyuan; Tang, Chenghuang; Tang, Hongqun; Zhan, Yongzhong

doi:10.1016/j.matchemphys.2015.10.003

Cited by 27 publications

(15 citation statements)

References 21 publications

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“…The dissolution of Sn was the only dissolution for solder alloys. Sn dissolution occurs according to the following reaction [34]:3Sn + 2Cl − + 4OH − − 6e − → Sn 3 O(OH) 2 Cl 2 + H 2 O…”

Section: Resultsmentioning

confidence: 99%

Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

Yang

et al. 2019

Materials

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This study investigates the effect of aluminum (Al) on the microstructure, micro-hardness, and wettability of environmentally friendly Sn-20Bi-xAl (x = 0, 0.1, 0.3, 0.5 (wt.%)) solder alloys. Scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS) analysis, and X-ray diffraction (XRD), were used to identify the microstructure morphology and composition. The spreading area and contact angle of the Sn-20Bi-xAl alloys on Cu substrates were used to measure the wettability of solder alloys. The results indicate that Al increased the hardness to a maximum value of ~27.1 HV for x = 0.5. When the content of Al was more than 0.3 wt.%, the hardness change value gradually flattened. From the spreading test results, Al reduced the wettability of solder alloys. When the content of Al was 0.1 wt.%, the change was slight. When more than 0.3 wt.%, the wettability of Sn-20Bi-xAl solder alloys sharply dropped. The corrosion resistance of Sn-20Bi-0.1Al alloy was the best, and the corrosion rate was at the lowest value at 0.092 mm/a due to the dense corrosion products.

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Section: Resultsmentioning

confidence: 99%

Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

Yang

et al. 2019

Materials

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“…Zhu et al [64] found that the addition of Cr inhibited the grain coarsening of Sn-Bi solder and refined the grain. Cr element plays a role of heterogeneous nucleation center in solder [65]. More heterogeneous nucleation particles are introduced into the composite solder to promote the refinement of solder structure.…”

Section: Sn-bi Low Temperature Lead-free Soldermentioning

confidence: 99%

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Zhang

Gao

et al. 2020

Science and Technology of Advanced Materials

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“…Beyond point E, a rapid increase in the current density occurs at high potential, polarizing up to point F, which is referred to as the transpassive potential or breakdown potential (Liu et al 2015). This increment in current density is due to the breakdown of the passive oxide layer at high potential.…”

Section: )mentioning

confidence: 99%

“…This increment in current density is due to the breakdown of the passive oxide layer at high potential. The breakdown of the passive film can also be caused by the presence of Cl − on the surface (Liu et al 2015;Mohanty & Lin 2005). Scanning more from point F results in a decrease in the current density.…”

Section: )mentioning

confidence: 99%

Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

Fayeka¹,

Haseeb²,

Fazal³

2017

JSM

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Sn-Ag based solder alloy seems to be a promising lead-free solder for the application on electronic assembly. The corrosion behavior of different lead free solder alloys such as Aloi pateri berasaskan Sn-Ag berpotensi menjadi pateri bebas-Pb untuk diaplikasikan sebagai pemasangan elektronik. Tindak balas kakisan aloi pateri bebas Pb yang berbeza seperti dikaji dalam larutan 3.5% NaCl menggunakan upaya dinamik pengutuban dan spektroskopi impedans elektrokimia. Mikroskop imbasan elektron (SEM), spektroskopi sinar-X tenaga terserak (EDX) dan pembelauan sinar-X (XRD) telah digunakan

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The electrochemical corrosion behavior of Pb–free Sn–8.5Zn–XCr solders in 3.5 wt.% NaCl solution

Cited by 27 publications

References 21 publications

Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

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