2004
DOI: 10.1016/j.ijheatmasstransfer.2004.02.010
|View full text |Cite
|
Sign up to set email alerts
|

The effects of topology upon fluid-flow and heat-transfer within cellular copper structures

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

2
125
0

Year Published

2008
2008
2019
2019

Publication Types

Select...
5
2

Relationship

0
7

Authors

Journals

citations
Cited by 264 publications
(127 citation statements)
references
References 16 publications
2
125
0
Order By: Relevance
“…The servo frame is subjected to a sinusoidal impact with amplitude of 10g acceleration and duration of 10ms . In this paper, the servo frame is fabricated by Nylon with the density of 3 …”
Section: Modal Analysis and Topology Optimizationmentioning
confidence: 99%
See 1 more Smart Citation
“…The servo frame is subjected to a sinusoidal impact with amplitude of 10g acceleration and duration of 10ms . In this paper, the servo frame is fabricated by Nylon with the density of 3 …”
Section: Modal Analysis and Topology Optimizationmentioning
confidence: 99%
“…It exhibits properties of high strength and rigidity except for weight reduction, realizes the shock resistance [2], heat transfer and insulation [3], sound absorption [4], and meets the requirements of multifunction [5]. Currently, when lattice material is used in the lightweight design of parts, mostly one kind of lattice material is chosen based on the designer's experience [6].…”
Section: Introductionmentioning
confidence: 99%
“…Bond setup usually consists of placing a thin interlayer between the substrates, but the interlayer material is occasionally placed outside the joint to flow in by capillarity [6,7,[9][10][11][12][13][14][15] as is done in many brazing processes. The interlayer material can be in many different formats:…”
Section: Tlp Bonding Processmentioning
confidence: 99%
“…• thin foil (rolled sheet) [2-4, 7, 16-62] • amorphous foil (melt-spun) [7, • fine powders (with or without binding agent) [5,7,[15][16][17][85][86][87][88][89][90][91][92][93][94][95][96][97][98] • powder compact (made by sintering, cold isostatic pressing, etc.) [57,[99][100][101] • brazing paste [9,17,[102][103][104] • a physical vapor deposition process such as sputtering [7, 18-21, 62-64, 105] • electroplating [10, 17-19, 30, 88, 106-112] • evaporating an element out of the substrate material to create a ''glazed'' surface [113].…”
Section: Tlp Bonding Processmentioning
confidence: 99%
See 1 more Smart Citation