1983
DOI: 10.1016/0003-2670(83)80010-5
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The effects of CopperZinc and CopperCadmium intermetallic compounds in different systems used for anodic stripping voltammetry

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Cited by 40 publications
(20 citation statements)
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“…As the procedure of voltammetric measurements included a zinc oxidation peak as well, it was found very interesting to present and to try to interpret behaviour of zinc pseudopolarograms in addition to the copper ones. The formation of CuZn intermetallic compound is not likely to occur, because of much lower concentrations of copper and zinc in our experiments when compared to those reported in literature, which should be in a milli-molar range [33,34]. While in the original sample total copper(II) concentration was found to be (1.48 ± 0.12) × 10 −8 mol L −1 , the concentration was 100 times higher (1.43 ± 0.17) × 10 −6 mol L −1 in the concentrated sample.…”
Section: Resultscontrasting
confidence: 53%
“…As the procedure of voltammetric measurements included a zinc oxidation peak as well, it was found very interesting to present and to try to interpret behaviour of zinc pseudopolarograms in addition to the copper ones. The formation of CuZn intermetallic compound is not likely to occur, because of much lower concentrations of copper and zinc in our experiments when compared to those reported in literature, which should be in a milli-molar range [33,34]. While in the original sample total copper(II) concentration was found to be (1.48 ± 0.12) × 10 −8 mol L −1 , the concentration was 100 times higher (1.43 ± 0.17) × 10 −6 mol L −1 in the concentrated sample.…”
Section: Resultscontrasting
confidence: 53%
“…This behavior is probably due to the depression of the cadmium wave by copper. The oxidation of the Cu‐Cd intermetallic compounds occurs near the same potential as copper, which increases the peak current of copper, and decreases the current of cadmium 44, 45.…”
Section: Resultsmentioning
confidence: 99%
“…The requirement for deoxygenation is not an insurmountable hindrance, even for in situ measurements, as various efficient online systems have been developed [4,18]. It is noted that any deposition step-related complications that may occur in SV will also be problematic for SCP, including i) formation of intermetallic compounds such as Zn/Cu [22], ii) insufficient ligand excess during the accumulation step, in the sense that, e.g., for a fully labile complex system the mean diffusion coefficient is no longer a constant over the diffusion layer if a significant gradient in ligand is present [9,23], and iii) the need to buffer solutions in some cases to avoid pH changes at the sensor surface [18].…”
Section: à3mentioning
confidence: 99%