1988
DOI: 10.1116/1.584156
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The effects of annealing encapsulant and ambient on the barrier height of WNx/GaAs contact and self-aligned gate field effect transistor fabrication

Abstract: Articles you may be interested inLow damage fully self-aligned replacement gate process for fabricating deep sub-100 nm gate length GaAs metal-oxide-semiconductor field-effect transistors J. Vac. Sci. Technol. B 28, C6L1 (2010); 10.1116/1.3501355 TiW nitride thermally stable Schottky contacts to GaAs: Characterization and application to selfaligned gate field effect transistor fabrication Characterization of reactively sputtered WN x film as a gate metal for selfalignment GaAs metal-semiconductor field effect … Show more

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