“…[2,6]) before the overgrowth of GaN, most groups try to avoid the nitridation of the Si surface, mainly because it may result in the formation of amorphous Si 3 N 4 obviously not suitable for subsequent epitaxial growth. This is, for example, achieved by depositing a first Al layer, typically in the monolayer (ML) range, before exposing intentionally the surface to both the Al and N fluxes necessary to grow the AlN buffer layer [3,4,7,12]. However, in most cases an unintentional partial nitridation of the surface cannot be completely eliminated, as rightly noted by Nikishin et al [4].…”