The effect of surface texturing on the laser-induced wetting behavior of AlSi5 alloy on Ti6Al4V alloy

Li, Haoyue; Li, Liqun; Huang, Rongrong; Tan, Caiwang; Yang, Jin; Xia, Hongbo; Chen, Bin; Song, Xiaojie

doi:10.1016/j.apsusc.2021.150630

Cited by 22 publications

(12 citation statements)

References 44 publications

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“…During wetting, chemical reactions and diffusion processes occur where the molten solder dissolves the substrate metal in a process called reactive wetting [39]. As the Sn-0.7Cu solder alloy reflows on the dimple-microtextured copper substrate, more copper diffused into the solder alloy due to the dimple microtextures on the surface providing an additional surface area that promotes diffusion and chemical reaction at the interface of the solder joint [7]. As per Dong et al [40], due to the presence of peaks and valleys on the surface, a larger surface area was obtained between the interface of the solder joint.…”

Section: Microstructure Analysis Of Sn-07cu Soldermentioning

confidence: 99%

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Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

et al. 2022

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This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.

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Section: Microstructure Analysis Of Sn-07cu Soldermentioning

confidence: 99%

“…Li et al [7] manufactured micro-grooves on Ti 6 Al 4 V substrates and reported that the wettability was enhanced only when the groove spacing exceeded 0.25 mm. Textured surfaces are commonly used to improve the adhesion between solid substrate surfaces.…”

Section: Introductionmentioning

confidence: 99%

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

et al. 2022

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“…10−13 The dynamics involved in laser heating can significantly differ from those involved in conventional heating. 10,14,15 Therefore, it is crucial to understand the laserinduced dynamics of materials and the associated challenges for the fabrication of advanced composites.…”

Section: ■ Introductionmentioning

confidence: 99%

“…This could result in different wetting dynamics as compared to those observed during slow heating. 10,12,14 These nonequilibrium effects, resulting in accelerated interfacial interactions at the solid− liquid (S/L) interface and triple line, determine the laser-induced wetting behavior in reactive systems. Moreover, it has been observed previously that the wetting time scales differ significantly between conventional heating (>100 s) and laser heating (a few seconds).…”

Section: ■ Introductionmentioning

confidence: 99%

Direct Visualization of Aluminum Particle Wetting on Carbon Using In Situ Laser Heating TEM

Kumari,

Ortalan

2023

J. Phys. Chem. C

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The fundamental understanding of aluminum particle wetting is critical for many industrial and military applications, such as nanocomposites, surface coatings, and explosives. In this study, the wetting behavior of aluminum particles on carbon is directly visualized using an in situ laser heating transmission electron microscope (ILH-TEM). Morphological, structural, and chemical analyses of the reaction products formed after laser irradiation of the aluminum−carbon system are characterized ex situ by scanning electron microscopy (SEM) and transmission electron microscopy (TEM) using imaging, diffraction, and electron energy loss spectroscopy (EELS). Different stages of the wetting were captured for ex situ analysis by exposing the samples to a varying number of laser pulses. Additionally, molecular dynamics (MD) simulations were carried out using a reactive force field (ReaxFF) to obtain an atomistic perspective of the aluminum−carbon interactions. The results show that dissolution and reaction occur during the wetting process and the spreading front advancement results from the reaction between aluminum and carbon at the triple line. The complete mechanism of aluminum wetting is discussed in detail, i.e., the impact of laser heating, breakdown of the passivation layer, and interaction of aluminum and carbon, resulting in wetting enhancement.

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“…Production of materials whose surface reveals hydrophobic or superhydrophobic properties is the subject of scientific research and new technological developments. The issue concerns both metallic, polymer-based materials and semiconductors [ 1 , 2 , 3 ]. The term “superhydrophobic” describes surfaces with a contact angle over 150°, which means very low wettability of such surfaces.…”

Section: Introductionmentioning

confidence: 99%

Enhanced Hydrofobicity of Polymers for Personal Protective Equipment Achieved by Chemical and Physical Modification

et al. 2021

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The article presents significant results in research on creating superhydrophobic properties of materials which can be used as an interesting material for use in self-cleaning polymer protective gloves and similar applications where the superhydrophobicity plays a significant role. In this work the influence of laser surface modification of MVQ silicone rubber was investigated. The research was conducted using a nanosecond-pulsed laser at 1060 nm wavelength. After a process of laser ablation, the surface condition was examined using a SEM microscope and infrared spectroscopy. During the tests, the contact angle was checked both before and after the laser modification of samples pre-geometrised in the process of their production. The test results presented in the paper indicate that the chemical and physical modifications contribute to the change in the MVQ silicone rubber contact angle. A significant increase (by more than 30°) in the contact angle to 138° was observed. It was confirmed that surface geometrisation is not the only factor contributing to an increase in the contact angle of the analyzed material; other factors include a change in laser texturing parameters, such as mean beam power, pulse duration, scanning speed and pulse repetition frequency.

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The effect of surface texturing on the laser-induced wetting behavior of AlSi5 alloy on Ti6Al4V alloy

Cited by 22 publications

References 44 publications

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

Direct Visualization of Aluminum Particle Wetting on Carbon Using In Situ Laser Heating TEM

Enhanced Hydrofobicity of Polymers for Personal Protective Equipment Achieved by Chemical and Physical Modification

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