1959
DOI: 10.1016/0022-3697(59)90283-5
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The effect of some surface treatments on the characteristics of fast states on germanium surfaces

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Cited by 7 publications
(3 citation statements)
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“…The condition for b a l a n c e is RI~R~_.~ -1 : R~R~ -1 : fl [1] whereR1._, is the resistance b e t w e e n contacts 1 and 2, etc. The added surface conductivity, • in the t h i n a r m as defined by B r a t t a i n a n d G a r r e t t (14) is AG = (1 + f l ) w t ( X , , , -X ) R 4~( 2 e #~p~m ( w + t)Rl~) -~ [2] w h e r e X,,~ is the f r a c t i o n a l helipot r e a d i n g for m i n im u m conductivity, X is the f r a c t i o n a l r e a d i n g at a point w h e r e AG is to be evaluated, ~ is hole mobility, p specific resistance, e electronic charge, ~ the Debye length, n, the c o n c e n t r a t i o n of holes a n d electrons in i n t r i n s i c g e r m a n i u m , w a n d t the w i d t h a n d t h i c kness of the t h i n p a r t of a r m 15.…”
Section: Methodsmentioning
confidence: 99%
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“…The condition for b a l a n c e is RI~R~_.~ -1 : R~R~ -1 : fl [1] whereR1._, is the resistance b e t w e e n contacts 1 and 2, etc. The added surface conductivity, • in the t h i n a r m as defined by B r a t t a i n a n d G a r r e t t (14) is AG = (1 + f l ) w t ( X , , , -X ) R 4~( 2 e #~p~m ( w + t)Rl~) -~ [2] w h e r e X,,~ is the f r a c t i o n a l helipot r e a d i n g for m i n im u m conductivity, X is the f r a c t i o n a l r e a d i n g at a point w h e r e AG is to be evaluated, ~ is hole mobility, p specific resistance, e electronic charge, ~ the Debye length, n, the c o n c e n t r a t i o n of holes a n d electrons in i n t r i n s i c g e r m a n i u m , w a n d t the w i d t h a n d t h i c kness of the t h i n p a r t of a r m 15.…”
Section: Methodsmentioning
confidence: 99%
“…It is inferred that the variations are due either to trace impurities deposited on the surface during etching (1) or other cleaning and handling procedures, interaction with the ambient (2), or to physical defects in the surface (e.g., emerging dislocations, steps, etc.) It is inferred that the variations are due either to trace impurities deposited on the surface during etching (1) or other cleaning and handling procedures, interaction with the ambient (2), or to physical defects in the surface (e.g., emerging dislocations, steps, etc.)…”
mentioning
confidence: 99%
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