The effect of saccharine on the localized electrochemical deposition of Cu-rich Cu–Ni microcolumns

Pané, Salvador; Panagiotopoulou, Vasiliki C.; Fusco, Stefano; Pellicer, Eva; Sort, Jordi; Mochnacki, D.; Sivaraman, Kartik M.; Kratochvil, Bradley E.; Baró, María Dolors; Nelson, Bradley J.

doi:10.1016/j.elecom.2011.06.015

Cited by 22 publications

(10 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For example, Seol et al synthesized different morphologies by varying the potential pulse profile in meniscus‐confined electroplating. Furthermore, the manipulation of the morphology and microstructure of wires synthesized using microelectrodes has been studied . Similarly, the microstructure of photoreduced deposits can be influenced by the use of surfactants …”

Section: Discussionmentioning

confidence: 99%

Additive Manufacturing of Metal Structures at the Micrometer Scale

et al. 2017

View full text Add to dashboard Cite

Currently, the focus of additive manufacturing (AM) is shifting from simple prototyping to actual production. One driving factor of this process is the ability of AM to build geometries that are not accessible by subtractive fabrication techniques. While these techniques often call for a geometry that is easiest to manufacture, AM enables the geometry required for best performance to be built by freeing the design process from restrictions imposed by traditional machining. At the micrometer scale, the design limitations of standard fabrication techniques are even more severe. Microscale AM thus holds great potential, as confirmed by the rapid success of commercial micro-stereolithography tools as an enabling technology for a broad range of scientific applications. For metals, however, there is still no established AM solution at small scales. To tackle the limited resolution of standard metal AM methods (a few tens of micrometers at best), various new techniques aimed at the micrometer scale and below are presently under development. Here, we review these recent efforts. Specifically, we feature the techniques of direct ink writing, electrohydrodynamic printing, laser-assisted electrophoretic deposition, laser-induced forward transfer, local electroplating methods, laser-induced photoreduction and focused electron or ion beam induced deposition. Although these methods have proven to facilitate the AM of metals with feature sizes in the range of 0.1-10 µm, they are still in a prototype stage and their potential is not fully explored yet. For instance, comprehensive studies of material availability and material properties are often lacking, yet compulsory for actual applications. We address these items while critically discussing and comparing the potential of current microscale metal AM techniques.

show abstract

Section: Discussionmentioning

confidence: 99%

Additive Manufacturing of Metal Structures at the Micrometer Scale

et al. 2017

View full text Add to dashboard Cite

show abstract

“…Pane et al fabricated microcolumns using sulfate-citrate baths with and without saccharine and observed that the addition of saccharine to the electrolytic solution resulted in the reduction of both the porosity and the surface roughness of the Cu-Ni [14]. Wang et al performed experiments in the presence and absence of bis-(3-sulfopropyl) disulfide (SPS) and chloride ions.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of n-shaped micro copper structures through localized electrochemical deposition

Wang

Tian²,

Pan

2023

J. Micromech. Microeng.

View full text Add to dashboard Cite

Localized electrochemical deposition (LECD) is a cost-effective technique for fabricating 3D microstructures. In this study, to fabricate a complete n-shaped micro copper structure, multi-layer deposition was adopted, and the v-groove was removed by an asymmetric trajectory. Thereafter, the merging mechanism of the n-shaped structure was analyzed using COMSOL simulations. The results demonstrated that multilayer deposition was suitable for connecting the copper column in different directions; the optimized layer was 15 layers with a height of 15 μm. The simulation showed that the v-groove was caused by the speed difference between the column and bumps, and an asymmetric trajectory with a height difference of 55 μm could suppress vertical deposition and remove the v-groove.

show abstract

“…For this purpose, localized electrochemical deposition (LECD) is a very promising method. Since LECD was first proposed by Madden et al in 1996 [1], various 3D microstructures, including high-aspect-ratio copper columns, springs, Cu-Ni alloy columns, copper walls, and other complex shapes, have been fabricated by LECD [1][2][3][4].…”

Section: Introductionmentioning

confidence: 99%

“…Bis-(3-sulfopropyl) disulfide and chloride ions have been found to increase the deposition rate of copper ions at low voltages to improve the surface quality of copper columns [14]. Furthermore, saccharin and saccharin sodium have been added to electrolytes to reduce the porosity and surface roughness of mcirocolumns [2,15]. However, the strong electric field between the electrodes may cause decomposition or rearrangement of organic additives.…”

Section: Introductionmentioning

confidence: 99%

Effect of sulfuric acid concentration on the quality of copper microcolumns in localized electrochemical deposition

Qing

Wang

2020

Mater. Res. Express

View full text Add to dashboard Cite

Localized electrochemical deposition (LECD) is a promising method for three-dimensional micro-/ nanofabrication and, thus, the factors influencing LECD have been intensively investigated. This study examined the effect of sulfuric acid concentration on copper microcolumns deposited by LECD using a microanode with a diameter of 20 μm. With 0.05 mol l −1 sulfuric acid, the deposition voltage of the optimal deposited morphology of copper microcolumns was at 2.9 V, but the column diameter was larger than the anode diameter. With 0.5 and 2.0 mol l −1 sulfuric acid, the optimal deposited morphology of copper microcolumns were at 3.2 V and 3.4 V, respectively, but the diameters of the copper microcolumns were smaller than the anode diameter. In the LECD process, the deposition rate is proportional to the deposition voltage. Because of the hydrogen evolution, the deposition rates of copper microcolumns at high sulfuric acid concentration were lower than those at low and medium sulfuric acid concentrations. The results of this study indicated that the deposition rate obtained the optimal surface topography was 0.22 to 0.327 um s −1 , which had reference significance to improve the quality of the copper microcolumns. The effect of sulfuric acid on the LECD was demonstrated using a competitive reduction mechanism.

show abstract

The effect of saccharine on the localized electrochemical deposition of Cu-rich Cu–Ni microcolumns

Cited by 22 publications

References 18 publications

Additive Manufacturing of Metal Structures at the Micrometer Scale

Additive Manufacturing of Metal Structures at the Micrometer Scale

Fabrication of n-shaped micro copper structures through localized electrochemical deposition

Effect of sulfuric acid concentration on the quality of copper microcolumns in localized electrochemical deposition

Contact Info

Product

Resources

About