The effect of precipitation on the electrical resistivity in Al-2.5 wt% Cu

Kenawy, M. A.; Nagy, Máté; Sakr, M. S.; Mostafa, M. A.

doi:10.1002/pssa.2210970149

Cited by 4 publications

(2 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Therefore, the scattering of the conduction electrons increased with the quantity of GP zones and tiny clusters. [29][30][31] Hence, the electron conductivity is decreased at that duration of natural aging, the electrical conductivity of the 24-hour naturally aged alloy (C 01 ) falling below that of the as-quenched alloy (C 0 ). Moreover, the literature [32] sited that the natural aging is a process of zone formation, and decreased conductivity during natural aging has been attributed to impairment of the periodicity of the lattice.…”

Section: B Electrical Conductivity Measurementsmentioning

confidence: 97%

Impact of Cu/Mg Ratio on Thermal Stability of Hot Extrusion of Al-4.6 Pct Cu-Mg-Ag Alloys

Chang

Lee

Hsu

et al. 2007

Metall Mater Trans A

View full text Add to dashboard Cite

This work explores how the Cu/Mg ratio affects the thermal stability of the extrusion of Al-4.6 pct Cu-Mg-Ag alloys at aerodynamic heating temperatures of up to 155°C for 1000 hours. The Cu/ Mg ratio was modified by adding various amounts of elemental Mg. The alloy microstructures, which determine thermal stability, were analyzed with an optical microscope, an electrical conductivity meter, a differential scanning calorimeter (DSC), and a transmission electron microscope. Experimental results indicate that reducing the Cu/Mg ratio of the alloy by the further addition of Mg causes X to become the primary strengthening phase after aging treatment, increasing the hardness and the thermal stability, although the h¢ phase is suppressed. The S phase does not affect the thermal stability of the alloy, because it is present in only a low quantity. Results of this study also demonstrate that the hot-extruded low Cu/Mg alloy satisfies the requirement of the material thermal stability of commercial supersonic aerial applications.

show abstract

Section: B Electrical Conductivity Measurementsmentioning

confidence: 97%

Impact of Cu/Mg Ratio on Thermal Stability of Hot Extrusion of Al-4.6 Pct Cu-Mg-Ag Alloys

Chang

Lee

Hsu

et al. 2007

Metall Mater Trans A

View full text Add to dashboard Cite

show abstract

“…The electrical resistivity of metal or alloy depends largely on lattice imperfections and on the impurities it contains. Measurements of electrical resistivity are usually used to follow the precipitation and dissolution processes resulting from the thermal treatments of alloys [1][2][3][4]. Ari et al investigated the thermo-electrical properties of Sn-Zn alloys for different compositions.…”

Section: Introductionmentioning

confidence: 99%

Effect of Annealing Temperature on the Electrical Resistivity of Sn-12wt%Sb Lead Free Solder Alloy

2007

Egyptian Journal of Solids

View full text Add to dashboard Cite

The effect of annealing temperatures in the range of 348K-448K on the electrical resistivity of Sn-12wt%Sb lead free solder alloy was investigated using the four-probe method. The time exponent (n) calculated from the time dependence of the isothermal electric resistivity curves has an average value of 0.02, which may be attributed to the increased number of Sb-atoms in the matrix resulting from the dissolution of the β-phase. The calculated values of the activation energy for different annealing times are ranged from 0.003 to 0.006 eV. From the electron micrographs, micro-structure investigations are also presented and discussed.

show abstract

Effect of ϵ-phase dissolution on electrical resistivity of torsionally deformed Cu-6 wt % Sn alloy

Shinoda

Fawzy

Graiss

et al. 1992

Solid State Communications

View full text Add to dashboard Cite

The effect of precipitation on the electrical resistivity in Al-2.5 wt% Cu

Cited by 4 publications

References 9 publications

Impact of Cu/Mg Ratio on Thermal Stability of Hot Extrusion of Al-4.6 Pct Cu-Mg-Ag Alloys

Impact of Cu/Mg Ratio on Thermal Stability of Hot Extrusion of Al-4.6 Pct Cu-Mg-Ag Alloys

Effect of Annealing Temperature on the Electrical Resistivity of Sn-12wt%Sb Lead Free Solder Alloy

Effect of ϵ-phase dissolution on electrical resistivity of torsionally deformed Cu-6 wt % Sn alloy

Contact Info

Product

Resources

About