“…Chemical Mechanical Planarization (CMP), a very critical and important step in semiconductor device fabrication, uses a combination of mechanical and chemical reactions to remove the surface structure, leaving a plane and damage free surface. Surface planarization of materials, including Al 2 O 3 , SiO 2 , InP, SiC and GaAs, using Colloidal SiO 2 based Slurries were studied [7][8][9][10][11][12].…”