The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy

Chang, M.; Salleh, Mohd Arif Anuar Mohd; Halin, Dewi Suriyani Che; Ramli, Mohd Izrul Izwan; Yasuda, Hideyuki; Nogita, Kazuhiro

doi:10.1016/j.jallcom.2021.163172

Cited by 7 publications

(1 citation statement)

References 42 publications

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“…However, due to the non-negligible risks of lead to the human body and environment, lead is required to be removed from electronic products. Currently, many lead-free solders have been studied in various fields as alternatives to Sn-Pb solders, such as Sn-Ag-Cu [ 1 , 2 ], Sn-Bi [ 3 , 4 ], Sn-Zn [ 5 ], Sn-Cu [ 6 ], Sn-In [ 7 ], and so on. Among them, the Sn-Bi series has been extensively studied by researchers for its lower cost and good wettability [ 8 , 9 , 10 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder

Yang

Qin

Feng³

et al. 2023

Materials

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The application of Sn-Bi series solder is limited due to the brittleness of Bi phase. Sn-20Bi solder with less Bi element content has great research prospects, but it needs modification to make it a substitute for traditional Sn-Pb solder. In this article, we mixed graphene nanosheets with nanometer Sn powder by means of ultrasonic oscillation, and Sn-20Bi-qGNS (q = 0.01, 0.02, 0.04, 0.06, and 0.1 wt.%) solder alloys were prepared by the melt-casting method. The effects of graphene nanosheets (GNSs) on the microstructure, physical properties, mechanical properties, and corrosion resistance of solder alloys were investigated. Scanning electron microscopy, energy dispersive spectroscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to determine the microstructural morphology and composition. The results showed that the melting point, density, and wettability of the solder decreased slightly with the addition of GNSs. The addition of GNSs as a second phase refined the solder structure and improved the tensile strength of the molten Sn-20Bi composite solder to 99.6 MPa, while elongation decreased with the addition of GNSs. Furthermore, GNSs prevented the MC Sn-20Bi-qGNSs/Cu intermetallic compound layers’ growth by interfering with atomic diffusion and grain boundary movement. In addition, the addition of 0.02 wt.% GNSs enhanced the shear strength of MC Sn-20Bi solder joints to 46.3 MPa. The electrochemical experimental results show that the surface corrosion products of MC Sn-20Bi-qGNSs under 3.5% NaCl solution were Sn3O(OH)2Cl2, with MC Sn-20Bi-0.01GNSs exhibiting the best corrosion resistance.

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Section: Introductionmentioning

confidence: 99%

Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder

Yang

Qin

Feng³

et al. 2023

Materials

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The Temperature-Dependent Phase Transformation and Microstructural Characterisation in In-Sn Solder Alloys

Zhou

Tan

et al. 2023

JOM

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Indium-based solder alloys are considered candidates for the next generation of low-temperature solder materials, especially for superconducting joints because of the properties of the β-In3Sn phase. The temperature-dependent phase transformation and thermal expansion behaviour of two different solder compositions including In-35Sn (in wt.%) and In-25.6Sn have been characterised using an in situ synchrotron powder X-ray diffraction method. The c-axis of the β-In3Sn unit cell in the In-35Sn alloy exhibited a complex relationship with increasing temperature compared to the positive increasing trend in In-25.6Sn due to the temperature-dependent solubility of Sn in β-In3Sn and change in the volume fraction of phases commencing at 80°C. In situ heating scanning electron microscopy recorded a real-time melting-solidification microstructure variation and phase transition during annealing at 90°C that was further analysed using energy dispersive X-ray spectroscopy. The observations are discussed with respect to the lattice parameters of the γ-InSn4 and β-In3Sn phases and the proportions and composition of both phases present within the alloys.

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Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

Yang,

Wu,

Zhang

et al. 2023

Weld World

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The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy

Cited by 7 publications

References 42 publications

Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder

Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder

The Temperature-Dependent Phase Transformation and Microstructural Characterisation in In-Sn Solder Alloys

Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

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