Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

Yang, Li; Wu, Haodong; Zhang, Yaocheng; Lu, Kaijian; Lin, Qiusheng

doi:10.1007/s40194-023-01621-4

Weld World

2023

DOI: 10.1007/s40194-023-01621-4

|View full text |Cite

Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

Li Yang,

Haodong Wu,

Yaocheng Zhang

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

Publication Types

Select...

Article3

Relationship

Self Cite0

Independent3

Authors

Journals

Cited by 3 publications

References 34 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy

Ye,

Li,

Zhang

et al. 2024

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy

Ye,

Li,

Zhang

et al. 2024

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Effect of bonding time on reliability of Cu/Sn-9Zn-30Cu/Cu solder joints for 3D packaging

Yang,

Liu,

Yang

et al. 2024

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Effect of Al particles addition on microstructure and shear properties of Cu/Sn-1Zn/Cu composite solder joints by transient liquid phase bonding

Li,

Wang,

Liang

et al. 2024

Materials Today Communications

View full text Add to dashboard Cite

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

hi@scite.ai

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

Cited by 3 publications

References 34 publications

Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy

Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy

Effect of bonding time on reliability of Cu/Sn-9Zn-30Cu/Cu solder joints for 3D packaging

Effect of Al particles addition on microstructure and shear properties of Cu/Sn-1Zn/Cu composite solder joints by transient liquid phase bonding

Contact Info

Product

Resources

About