The effect of nanoperlite and its silane treatment on the crystallinity, rheological, optical, and surface properties of polypropylene/nanoperlite nanocomposite films

Davachi, Seyed Mohammad; Heidari, Behzad Shiroud; Sahraeian, Razi; Abbaspourrad, Alireza

doi:10.1016/j.compositesb.2019.107088

Cited by 30 publications

(13 citation statements)

References 42 publications

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“…Below percolation, the storage modulus was not found to increase significantly. As the content of filler increases, the slope of the storage modulus versus the angular frequency decreases, especially above the percolation threshold [70,71]. At 20 wt% (LDPE/EVA/G20_A) a transition occurred and the material showed a pseudo-solid-like curve, which is related to the formation of strong particles networks throughout the composite, leading to a noticeable increase of storage modulus, as found in [72].…”

Section: Rheological Propertiesmentioning

confidence: 99%

Electrical, thermal and rheological properties of low-density polyethylene/ethylene vinyl acetate/graphene-like composite

Azizi

Ouellet-Plamondon

Nguyen‐Tri

et al. 2019

Composites Part B: Engineering

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Composites of low-density polyethylene (LDPE), ethylene vinyl acetate (EVA), and a graphene-like material were explored for their electrical properties for use in high-volume lowcost conductive applications. A graphene-like material, obtained from hybrid clay-sucrose carbonization, was investigated as an alternative filler with advantages over conventional graphene technology. The electrical properties of the composites as synthesized by the solvent-casting technique were studied using broadband dielectric spectroscopy. The percolation threshold was identified for both as synthesized and annealed composite samples. Due to charge transport and electrode polarization, the sub-percolating composites exhibited low frequency dispersion particularly at elevated temperatures. Composites of LDPE/EVA/graphene-like above the percolation threshold exhibited a higher rheological storage modulus and thermal stability which indicates an alignment between the electrical, thermal and rheological properties.

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Section: Rheological Propertiesmentioning

confidence: 99%

Electrical, thermal and rheological properties of low-density polyethylene/ethylene vinyl acetate/graphene-like composite

Azizi

Ouellet-Plamondon

Nguyen‐Tri

et al. 2019

Composites Part B: Engineering

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“…With increasing frequency, the complex viscosity of the pure PP and the composites decreases, exhibiting non-Newtonian behavior. At higher frequencies, there is not enough time for the polymer chains to respond to the different motions applied, which could justify the unchanged behavior noted . The moduli G ’ and G ″ increase as a function of frequency, with G ″ > G’ over most of the present testing ranges as a sign of the predominant viscous response.…”

Section: Resultsmentioning

confidence: 86%

Polypropylene Modified with Ag-Based Semiconductors as a Potential Material against SARS-CoV-2 and Other Pathogens

Assis

Ribeiro

Gonçalves

et al. 2022

ACS Appl. Polym. Mater.

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The worldwide outbreak of the coronavirus pandemic (COVID-19) and other emerging infections are difficult and sometimes impossible to treat, making them one of the major public health problems of our time. It is noteworthy that Ag-based semiconductors can help orchestrate several strategies to fight this serious societal issue. In this work, we present the synthesis of α-Ag 2 WO 4 , β-Ag 2 MoO 4 , and Ag 2 CrO 4 and their immobilization in polypropylene in the amounts of 0.5, 1.0, and 3.0 wt %, respectively. The antimicrobial activity of the composites was investigated against the Gram-negative bacterium Escherichia coli, the Gram-positive bacterium Staphylococcus aureus, and the fungus Candida albicans. The best antimicrobial efficiency was achieved by the composite with α-Ag 2 WO 4 , which completely eliminated the microorganisms in up to 4 h of exposure. The composites were also tested for the inhibition of SARS-CoV-2 virus, showing antiviral efficiency higher than 98% in just 10 min. Additionally, we evaluated the stability of the antimicrobial activity, resulting in constant inhibition, even after material aging. The antimicrobial activity of the compounds was attributed to the production of reactive oxygen species by the semiconductors, which can induce high local oxidative stress, causing the death of these microorganisms.

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“…After that, silane treated filler particles were rinsed with demineralized water. Generally, silane treatment improves the interaction between filler and polymer matrix [38]. Fine and coarse filler particles were used to fabricate the composite preparation.…”

Section: Matrix and Filler Materialsmentioning

confidence: 99%

A Novel Approach on Reusing Silicon Wafer Kerf Particle as Potential Filler Material in Polymer Composite

Nambiraj

Rajkumar

Sabarinathan

2021

Silicon

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In solar panel production stage, it is unavoidable to neglect the huge amount of solar grade silicon particles displaced during the slicing of silicon ingot operation. A subject of the present study is to reuse the solar-grade silicon particles as a filler to enhance the mechanical properties of the epoxy-glass fiber polymer composite. Polymer composite was fabricated using a hand-layup method with constant hydraulic pressure by varying filler weight percentages of 0, 1, 3, 5, and 10 %. Particle size and mineralogical features of the recovered silicon particle were characterized by particle size analyser and X-ray diffraction analysis. A positive effect on the mechanical properties of the prepared composites is seen by the recovered silicon particle addition. Maximum tensile strength of 284 MPa has been achieved for the < 10 µm particle with a 5 % weight of silicon filler loaded composite. Both the flexural strength and the hardness of the composites were improved linearly by the addition of the filler material. The dielectric constant is considerably improved by incorporating recovered silicon filler into the epoxy polymer composite. There is a comparatively higher dielectric constant value of 5.96 in a fine silicon particle-filled composite than in a coarse silicon particle-filled composite of 4.8. The sustainable use of silicon wafer cutting particles in polymer composites would mitigate the problems of pollution and minimise the cost of silicon wafer waste disposal as well. This brings up the solution to recycling of silicon wafer cutting waste for a sustainable environment.

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The effect of nanoperlite and its silane treatment on the crystallinity, rheological, optical, and surface properties of polypropylene/nanoperlite nanocomposite films

Cited by 30 publications

References 42 publications

Electrical, thermal and rheological properties of low-density polyethylene/ethylene vinyl acetate/graphene-like composite

Electrical, thermal and rheological properties of low-density polyethylene/ethylene vinyl acetate/graphene-like composite

Polypropylene Modified with Ag-Based Semiconductors as a Potential Material against SARS-CoV-2 and Other Pathogens

A Novel Approach on Reusing Silicon Wafer Kerf Particle as Potential Filler Material in Polymer Composite

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