2011
DOI: 10.1016/j.jcrysgro.2010.11.142
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The effect of graphite components and crucible coating on the behaviour of carbon and oxygen in multicrystalline silicon

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Cited by 42 publications
(23 citation statements)
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“…Once the melting front reaches the top surface of the Si feedstock, the reactions (4), (5), and (6) can occur at the gas/melt interface. The distributions of SiO and CO in the gas domain during the melting stage are shown in figure 4(a).…”
Section: Transport Of the Species During The Melting Processmentioning
confidence: 99%
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“…Once the melting front reaches the top surface of the Si feedstock, the reactions (4), (5), and (6) can occur at the gas/melt interface. The distributions of SiO and CO in the gas domain during the melting stage are shown in figure 4(a).…”
Section: Transport Of the Species During The Melting Processmentioning
confidence: 99%
“…If transported to the growth zone, gaseous CO can decompose into C and O in the melt. Furthermore, CO also reacts with solid or molten Si and generates silicon carbide (SiC) as a byproduct [4][5][6]. SiC either dissolves into the melt as C contamination or incorporates into the growing crystal as solid SiC particles, causing dislocations and defects inside the crystal.…”
Section: Introductionmentioning
confidence: 99%
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“…Multi-crystalline · Low production cost · High-capacity production · Reduction of efficiency by defect · Grain boundary control -Increase of 3 grain boundary density [3] -Application of crucible noncontact technology [9] -Increase of cooling temperature [10] · Impurity control -Reduction of atmospheric CO transport [11] -Disuse of graphite component [12] -Use of Si 3 N 4 coated crucible [13] Mono-like Si · Low production cost · High efficiency · Reduction of single crystal fraction by nucleation from side crucible · Hot zone design [16,17] -Insulator supplement and cooling increase at bottom · Seed orientation control [4] · Heat loss control -Installation of insulation partition at heat loss part [18] …”
Section: 산소 석출을 감소시키기 위해mentioning
confidence: 99%
“…These wafers are sliced from crystals grown either by the Czochralski (CZ) 3) crystal growth technique used in the microelectronics industry or from much larger ingots prepared by directional solidification (DS) 4) techniques that result in multicrystalline silicon.…”
Section: Introductionmentioning
confidence: 99%