Abstract:Carbon contamination in single crystalline silicon is detrimental to the minority carrier lifetime, one of the critical parameters for electronic wafers. In order to study the generation and accumulation of carbon contamination, transient global modeling of heat and mass transport was performed for the melting process of the Czochralski silicon crystal growth. Carbon contamination, caused by the presence of carbon monoxide in argon gas and silicon carbide in the silicon feedstock, was predicted by the fully co… Show more
“…They reported the results by suing a quasi-static meth calculation. Such a method cannot take into account C accumulation during CZ-Si c growth [6], then the quasi-static assumption is not able to predict the C content in Si Then, the transient method of heat and mass transport is necessary to study C cond tion quantitatively during the melting process of CZ-Si crystal growth [15].…”
Impurity concentrations of oxygen, carbon, nitrogen, iron, and other heavy metals should be well controlled in silicon crystals to maintain the crystal quality for application in electronic and solar cell devices. Contamination by impurities occurs during the melting of raw materials and during the crystal growth process. Quantitative analysis of impurity transfer using numerical and experimental analysis is important to control impurity concentrations. This paper reviews the analysis of the impurity transport phenomena in crystal growth furnaces of Czochralski and directional solidification methods by a model of global analysis and an experiment during the crystal growth of silicon.
“…They reported the results by suing a quasi-static meth calculation. Such a method cannot take into account C accumulation during CZ-Si c growth [6], then the quasi-static assumption is not able to predict the C content in Si Then, the transient method of heat and mass transport is necessary to study C cond tion quantitatively during the melting process of CZ-Si crystal growth [15].…”
Impurity concentrations of oxygen, carbon, nitrogen, iron, and other heavy metals should be well controlled in silicon crystals to maintain the crystal quality for application in electronic and solar cell devices. Contamination by impurities occurs during the melting of raw materials and during the crystal growth process. Quantitative analysis of impurity transfer using numerical and experimental analysis is important to control impurity concentrations. This paper reviews the analysis of the impurity transport phenomena in crystal growth furnaces of Czochralski and directional solidification methods by a model of global analysis and an experiment during the crystal growth of silicon.
“…Reactions ( 4)-( 6) are involved at the gas/Si interface and in the unmelted Si feedstock. To investigate the surface reaction and deposition, a simplified model for SiC generation by the reaction between CO and Si was used for the surface of the packed Si chunks 17) . O, C, SiO, CO, and SiC coexist in the unmelted Si feedstock and at the gas/Si interface.…”
Section: Reactions and Deposition On The Surface Of Si Chunksmentioning
confidence: 99%
“…Transport phenomena of C as well as relevant impurities and species in the CZ-Si process have been extensively studied in the last few decades [9][10][11][12][13][14][15][16][17] . It has been found that back diffusion of the generated CO is the main origin of C contamination in Si feedstock.…”
Section: Introductionmentioning
confidence: 99%
“…However, the C content predicted under the quasi-static assumption does not account for C accumulation during CZ-Si crystal growth 11) . Transient global simulations of heat and mass transport have been performed for C accumulation in the melting process of CZ-Si crystal growth 16,17) . However, in these studies, packed Si chunks were modeled with the thermal conductivity of bulk Si.…”
“…Liu et al. recently addressed the generation, transport, and accumulation of C during the melting process in a CZ‐Si furnace. The accumulation of C in the melt was investigated according to the transient feature of the CZ‐Si process.…”
In Czochralski silicon (CZ-Si) crystal growth, species generated from high temperature reactions and transported by Si melt and argon (Ar) gas strongly affect the purity and quality of the grown crystals. The reduction of carbon (C) contamination in crystal is required for producing Si wafers with long carrier lifetimes. Advances in the modeling of C contamination in CZ-Si growth are reviewed on the basis of the mass transport phenomena in the Ar gas and Si domains. The generation, incorporation, and accumulation of C were investigated by the transient global simulations of heat and mass transport during the melting process of CZ-Si growth. In addition to graphite etching, two additional sources of carbon monoxide (CO) were analyzed according to their contributions to the accumulation of C in the Si melt. The effect of gas flow control on the back diffusion of the generated CO was examined via a parametric study of the furnace pressure and the Ar gas flow rate. Strategies for C content reduction are discussed on the basis of the mechanisms of C accumulation, which indicate that the final C content depends on both the growth duration as well as the flux of contaminants at the gas/melt interface.
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