The Effect of Geopolymer Ceramic Additions to The Wettability and Shear strength of Sn-Ag-Cu (SAC) Solder: A Preliminary Study

Abstract

The effect of geopolymer ceramics addition into Sn-3.0Ag-0.5Cu (SAC305) lead free solder was successfully investigated. The lead-free solder SAC305 with the addition of geopolymer ceramics was fabricated by using powder metallurgy microwave-sintering method in order to form a composite solder. The composite solder was analyzed based on wettability and shear strength. The wettability of SAC 305 solder was greatly enhanced with the decreasing in its contact angle. Then, the geopolymer ceramic addition enhanced the shear strength of SAC 305 solder.

Effect of kaolin geopolymer ceramic addition on the properties of Sn-3.0Ag-0.5Cu solder joint

“…Thus, there exist many organizations such as Institute of Printed Circuits (IPC), The National Electronics Manufacturing Initiative (NEMI), the National Institute of Standard and Technology (NIST) and the National Center for Manufacturing Science (NCMS) that are actively searching for the best solder alloys in replacement of tin lead solder and implemented into the electronic products [2]. Among the various emerging lead free solder, Sn-Ag-Cu (SAC) lead free solder alloy posed the most outstanding choice by the industry in replacing conventional Sn-Pb solder alloy [2,3]. This was owing to SAC lead free solder alloy shows a good wettability, better solder joint strength and lower melting point than the other Sn-based solder alloys [4][5][6].…”