The effect of downscaling the dimensions of solder interconnects on their creep properties

Wiese, S.; Roellig, M.; Mueller, Maik; Wolter, Klaus‐Jürgen

doi:10.1016/j.microrel.2008.03.026

Cited by 45 publications

(16 citation statements)

References 24 publications

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“…In previous related studies, characterization of constitutive alloy behavior is usually done through tensile tests using standard specimens. To obtain a relevant constitutive data for real interconnections, the specimens had to be scaled down to a typical solder joint size if one considers the extremely small solder volumes in modern microelectronic industry [11,12]. Therefore, the design optimization of solder joints could be conducted with different geometries to investigate the tensile behavior.…”

Section: Methodsmentioning

confidence: 99%

Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying

El-Daly

El-Hosainy

Elmosalami

et al. 2015

Journal of Alloys and Compounds

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Section: Methodsmentioning

confidence: 99%

Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying

El-Daly

El-Hosainy

Elmosalami

et al. 2015

Journal of Alloys and Compounds

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“…34 Scale effects of deformation of solder alloys have been discussed, because solder joint sizes have recently become small, e.g., on the micron scale. 13,35 However, study of bulk solder remains important to understand details of the ratchetting deformation of Pb-free and Pb-containing solder alloys, as it is difficult to obtain accurate test results using micron-scale specimens of actual solder joints. For example, deformation of micron-scale specimens is affected by crystal orientations in the specimens because they contain small numbers of crystals.…”

Section: Methodsmentioning

confidence: 99%

“…[5][6][7][8][9][10][11][12][13][14][15][16] The authors have conducted creep tests using Pb-free and Pb-containing solder alloys and conducted structural analyses of electronic packaging. 5 It was concluded that the creep deformation of Pb-free solder alloys is smaller than that of Pb-containing solder alloys and that time-dependent deformation plays an important role in the reliability of solder joints of electronic packaging.…”

Section: Introductionmentioning

confidence: 99%

“…This research showed that solder alloys undergo extensive time-dependent deformation such as creep and ratchetting deformation. Wises et al 13 studied the size effect on the creep deformation of solder alloys using a bulk specimen and a micro solder ball. Ma and Suhling 14 reviewed the time-dependent deformation of both lead-free and lead-containing solder alloys and showed the differences in their timedependent deformation.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Uniaxial Ratchetting Behavior of Solder Alloys and Its Simulation by an Elasto-Plastic-Creep Constitutive Model

Sasaki

Ohguchi

2011

Journal of Elec Materi

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Ratchetting deformation occurring at solder joints in electronic packaging is a concern for electronic devices. Therefore, ratchetting deformation due to thermal cycling at solder joints should be simulated by structural analysis employing tools such as the finite-element method (FEM). However, simulation of ratchetting deformation is difficult, and little modeling to simulate ratchetting deformation accurately has been reported. This work experimentally examines uniaxial ratchetting deformation of Pb-free and Pb-containing solder alloys to elucidate the effect of rate on uniaxial ratchetting. An elastoplastic-creep constitutive model is developed to simulate uniaxial ratchetting deformation. The constitutive model incorporates a method to determine the material constants simply from a small number of pure tensile tests and subsequent stress relaxation tests. Uniaxial ratchetting deformation of solder alloys was successfully simulated using this constitutive model and simple method for material constant determination.

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“…For thin films and thin layers the deformation or damage mechanism "feel" the presence of the surface or an interface (Arzt 1998;Kraft et al 2010). As a result, the inelastic response of microcomponents and solder joints depends essentially on their dimensions (Wiese et al 2008;Wiese 2010). Experimental results on inelastic behavior of thin films and micropillars are reviewed in (Kraft et al 2010).…”

Section: Microstructural Features and Length Scale Effectsmentioning

confidence: 99%

Analysis of Inelastic Behavior for High Temperature Materials and Structures

Naumenko

Altenbach

2015

Advanced Structured Materials

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This review provides a current status in modeling and analysis of structures for high-temperature applications. Basic features of inelastic behavior of heat resistant alloys are discussed. Typical responses for stationary and varying loading and temperature are presented and classified. Microstructural features and microstructural changes in the course of inelastic deformation at high temperature are discussed. The state of the art on material modeling and structural analysis in the inelastic range at high temperature is resented.Keywords Creep · Low cycle fatigue · Damage mechanics · Length scales · Temporal scales · Structural analysis IntroductionThe aim of this contribution is to give an overview of experimental and theoretical approaches to analyze the behavior of materials and structures subjected to mechanical loading and "high-temperature" environment. The definition of "hightemperature" materials and "high-temperature" structures can be related to the value of the homologous temperature, that is T /T m , where T is the absolute temperature and T m is the melting point of the considered material. Materials that can be efficiently used within the temperature range 0.3 < T /T m < 0.7 are called hightemperature materials. Examples include heat resistant steels, nickel-bases alloys, age-hardened aluminum alloys, cast iron materials and metal matrix composites. Structures that operate in the temperature range 0.3 < T /T m < 0.7 over a long period of time are called high-temperature structures. Examples include turbine

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The effect of downscaling the dimensions of solder interconnects on their creep properties

Cited by 45 publications

References 24 publications

Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying

Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying

Uniaxial Ratchetting Behavior of Solder Alloys and Its Simulation by an Elasto-Plastic-Creep Constitutive Model

Analysis of Inelastic Behavior for High Temperature Materials and Structures

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