The effect of dislocation self-interaction on the orowan stress

Bacon, D. J.; Kocks, U.F.; Scattergood, R.O.

doi:10.1080/14786437308227997

Cited by 452 publications

(230 citation statements)

References 10 publications

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“…The pinning strength cos(φ c /2) obeys the empirical logarithmic law which has been found in [15,16]. The distance between the void center and the glide plane (the impact parameter) is found to affect the pinning strength in asymmetric manner.…”

Section: Discussionmentioning

confidence: 89%

“…also in the context of the Orowan mechanism [16]. Since their computation deals with only the critical stresses for pure edge dislocations and screw dislocations, it does not quantitatively apply to the partial dislocations.…”

Section: B Void Size Dependencementioning

confidence: 99%

“…Scattergood et al have presented the calculation on the dislocation pinning by a void based on the framework of Bacon et al [16]. It is a continuous model that incorporates the self-interaction of a dislocation.…”

Section: B Comparison With a Continuous Model With Self-interactionmentioning

confidence: 99%

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Molecular dynamics investigation of dislocation pinning by a nanovoid in copper

Hatano

Matsui

2005

Phys. Rev. B

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Interactions between an edge dislocation and a void in copper are investigated by means of molecular dynamics simulation. The depinning stresses of the leading partial and of the trailing partial show qualitatively different behaviors. The depinning stress of the trailing partial increases logarithmically with the void radius, while that of the leading partial shows a crossover at 1 nm above which two partials are simultaneously trapped by the void. The pinning angle, which characterizes the obstacle strength, approaches zero when the void radius exceeds 3 nm. No temperature dependence is found in the critical stress and the critical angle. This is attributed to an absence of climb motion. The distance between the void center and a glide plane asymmetrically affects the pinning strength.

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Section: Discussionmentioning

confidence: 89%

Section: B Void Size Dependencementioning

confidence: 99%

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Molecular dynamics investigation of dislocation pinning by a nanovoid in copper

Hatano

Matsui

2005

Phys. Rev. B

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“…In the early times, simulation methods have been applied to rather simple situations, for instance the motion of a single dislocation line through a random distribution of point obstacles representing either forest dislocations or a distribution of small precipitates ( [1][2][3]). In the last 10 years, a substantial improvement of the range and realism of such simulations has been made possible by the increase in computing power.…”

Section: Introductionmentioning

confidence: 99%

Mesoscopic simulations of plastic deformation

Devincre

Kubin

Lemarchand

et al. 2001

Materials Science and Engineering: A

160

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This review is focused on recent progress achieved by mesoscopic simulations of plastic deformation. The methods presently available for discretizing the dislocation lines are critically discussed with emphasis on a new lattice-based model. Progress in large-scale simulations is represented by a study on the influence of long range elastic stresses on the formation of dislocation patterns in fcc crystals. A hybrid discrete-continuum method that provides an exact treatment of the boundary conditions is described and illustrated by an investigation of the critical conditions for dislocation motion in the channels of γ /γ superalloys.

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“…A straightforward estimation gives ~114.4 nm. Applying the conventional Baker-KocksScattergood (BKS) modification of the Orowan model [40]:…”

Section: Mechanical Behaviormentioning

confidence: 99%

Mechanical behavior and microstructure properties of titanium powder consolidated by high-pressure torsion

Zhilyaev

Ringot

Huang

et al. 2017

Materials Science and Engineering: A

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Abstract.Research was conducted to investigate the potential for consolidating titanium powder using high-pressure torsion (HPT) at room temperature. The nanostructured samples processed by HPT were characterized by X-ray diffraction (XRD) and transmission electron microscopy (TEM).The results show there is a significant refinement of the Ti powder and it consolidates into bulk nanostructured titanium with a mean grain size estimated by TEM as ~200-300 nm and a mean crystallite size measured by XRD as ~20-30 nm. Microhardness measurements and tensile testing show high strength and low ductility after consolidation under a pressure of 6.0 GPa for 5 revolutions. Additional short annealing at a temperature of 300°C for 10 minutes leads to a significant enhancement in ductility while maintaining the high strength.

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The effect of dislocation self-interaction on the orowan stress

Cited by 452 publications

References 10 publications

Molecular dynamics investigation of dislocation pinning by a nanovoid in copper

Molecular dynamics investigation of dislocation pinning by a nanovoid in copper

Mesoscopic simulations of plastic deformation

Mechanical behavior and microstructure properties of titanium powder consolidated by high-pressure torsion

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