2010
DOI: 10.1016/j.electacta.2010.04.015
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The effect of Cu addition on the electrochemical corrosion and passivation behavior of stainless steels

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Cited by 154 publications
(60 citation statements)
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(60 reference statements)
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“…These positions are governed mainly by the charge transfer across the semiconductor/electrolyte interface, the contact potential between semiconductor and electrolyte, and the stability of the semiconductor. According to the energy-band model [74], for a sample covered with an n-type semiconducting passive film, it behaves as a conductor at potentials more negative than the passive film's flat band potential, as the passive film enters an accumulation mode. In contrast, at potentials more positive than E fb , the band bending creates a barrier (space charge layer) to electron transfer, and the sample shows a dielectric characteristic.…”
Section: Influence Of Nb Addition On the Electronic Properties Of Pasmentioning
confidence: 99%
“…These positions are governed mainly by the charge transfer across the semiconductor/electrolyte interface, the contact potential between semiconductor and electrolyte, and the stability of the semiconductor. According to the energy-band model [74], for a sample covered with an n-type semiconducting passive film, it behaves as a conductor at potentials more negative than the passive film's flat band potential, as the passive film enters an accumulation mode. In contrast, at potentials more positive than E fb , the band bending creates a barrier (space charge layer) to electron transfer, and the sample shows a dielectric characteristic.…”
Section: Influence Of Nb Addition On the Electronic Properties Of Pasmentioning
confidence: 99%
“…Postrach et al 15) claimed that the films of alloys containing Cu, according to the accelerated open circuit breakdown of Cu bearing samples, are less stable than expected, which is related to a faster removal of the oxide film. Oguzie et al 16) reported that Cu has negative effects on the stability of the passive film of austenitic, ferritic and martensitic stainless steels in the sulfuric acid solution due to the presence of Cu in the passive film as cupric ions increased the donor (N D ) and acceptor (N A ) densities affecting the film stability. These inconsistent results on the passivity of stainless steels revealed a very complex role played by Cu.…”
Section: Introductionmentioning
confidence: 99%
“…Cu alloying in combination with appropriate heat treatment is used to produce a special class of antibacterial steels that have antimicrobial activity due to ε-Cu precipitation of on the steel surface. 24) The uniform dispersion of the ε-Cu nanoparticles provides stronger interactions and obstacles to the dislocation motion, thus resulting in an increase in the strength of the steel. The elongation and impact toughness of the steel did not experience an apparent decrease due to the particle size remaining extremely small (~30 nm).…”
Section: Microstructure and Mechanical Propertiesmentioning
confidence: 99%