2020
DOI: 10.1063/5.0026353
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The effect of annealing process on the performance of strain nickel–chromium thin film sensor

Abstract: In order to reduce the resistance value of the sputtering thin film resistor grid and improve the adhesion of the film, a thin film sensor with the NiCr film as a sensitive layer on a 304 stainless steel substrate is annealed in the N2 environment. During the experiment, it is found that the different annealing temperatures (300 °C, 350 °C, 400 °C, 450 °C, and 500 °C) can effectively reduce the resistance value of the thin film resistor grid; the decrease is the largest at 450 °C, and the resistance value chan… Show more

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Cited by 4 publications
(1 citation statement)
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“…Clustering of particles is observed over the film surface with increase in thermal energy. As the annealing temperature increases, the energy of the particles increase and they become more likely to diffuse and aggregate [38]. The cracks observed on the surface of the film annealed at 900 • C are expected to be due to the strain experienced by the films at elevated temperatures due to the difference in thermal expansion coefficients of the Ga and quartz substrate [39].…”
Section: Resultsmentioning
confidence: 99%
“…Clustering of particles is observed over the film surface with increase in thermal energy. As the annealing temperature increases, the energy of the particles increase and they become more likely to diffuse and aggregate [38]. The cracks observed on the surface of the film annealed at 900 • C are expected to be due to the strain experienced by the films at elevated temperatures due to the difference in thermal expansion coefficients of the Ga and quartz substrate [39].…”
Section: Resultsmentioning
confidence: 99%