2012
DOI: 10.1134/s1063782612020145
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The effect of annealing on the properties of Ga2O3 anodic films

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Cited by 10 publications
(9 citation statements)
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“…While these results agree, in general, with results reported in literature for Ga 2 O 3 films fabricated by physical methods, differences arise due to the differences in synthesis conditions adopted for deposition, substrate materials, and physical parameters (thickness, density, etc.). For instance, while the noted trend is very similar to annealing behavior of polycrystalline Ga 2 O 3 films made by anodic oxidation of n-GaAs wafers, 26 there are significant difference in the observed values of roughness values and grain size and shapes. The Ga 2 O 3 anodic films exhibit linear grain sizes, where grains were in the form of squares with a side length of 600−700 nm.…”
Section: ■ Experimental Sectionsupporting
confidence: 56%
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“…While these results agree, in general, with results reported in literature for Ga 2 O 3 films fabricated by physical methods, differences arise due to the differences in synthesis conditions adopted for deposition, substrate materials, and physical parameters (thickness, density, etc.). For instance, while the noted trend is very similar to annealing behavior of polycrystalline Ga 2 O 3 films made by anodic oxidation of n-GaAs wafers, 26 there are significant difference in the observed values of roughness values and grain size and shapes. The Ga 2 O 3 anodic films exhibit linear grain sizes, where grains were in the form of squares with a side length of 600−700 nm.…”
Section: ■ Experimental Sectionsupporting
confidence: 56%
“…The Ga 2 O 3 anodic films exhibit linear grain sizes, where grains were in the form of squares with a side length of 600−700 nm. 26 After annealing, Ga 2 O 3 anodic film roughness increased to 100−120 nm, which exceedingly higher compared to sputterdeposited films. While the trend is similar, the differences are primarily attributed to the preparation methods, that is, anodic oxidation under oxygen plasma versus sputter deposition under reactive conditions.…”
Section: ■ Experimental Sectionmentioning
confidence: 97%
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