The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder

Chiang, Huann-Wu; Chang, Kenndy; Chen, Jun-Yuan

doi:10.1007/s11664-006-0316-5

Cited by 20 publications

(4 citation statements)

References 16 publications

(20 reference statements)

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“…On the one hand, with the Ag level increasing it need more Sn to form thick lath Ag 3 Sn, so the fraction of -Sn phase decreases. On the other hand, the precipitating of Ag 3 Sn on the -Sn grain boundary obstructs the growth of -Sn grain [6]. During the solder solidification process, the higher the Ag level is, the more Ag 3 Sn will be formed which leads the strength of solder alloy increasing but plasticity decreasing [7].…”

Section: B Mechanical Propertymentioning

confidence: 99%

Investigation on reliability of low-Ag lead-free solder alloy

Zhang

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

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The main objective of this paper is to investigate the reliability of low-Ag lead-free solder alloy. The wettability, mechanical property and microstructure of Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloys were comparatively investigated. Experimental studies have shown that the wetting property of low-Ag lead-free solder alloy SAC105 remains to be improved and mechanical strength is lower to SAC305, but its anti-drop and anti-shock performance are outstanding. Though the wetting property of SAC105 is inferior to SAC305, the melting point and wettability of SAC105 can meet the actual reliability requirements of products. Matched with appropriate process, low-Ag lead-free solder can also form reliable solder joints to meet the reliability standards in industrial production.

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Section: B Mechanical Propertymentioning

confidence: 99%

Investigation on reliability of low-Ag lead-free solder alloy

Zhang

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

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“…; and thus intended to gradually replace Sn-Pb alloys in current applications. In this context, great effort was deployed to propose alternative lead-free binary or ternary eutectic alloys, such as Sn-Zn [2,3], Sn-Sb [2,4], Sn-Ag [5][6][7] and SnAgCu [8,9]. However, all of these alloys have relatively low melting points (between 80 • C and 240 • C), which make them unsuitable for electronic power components intended for applications in extreme conditions (high temperature, etc.)…”

Section: Introductionmentioning

confidence: 99%

The Polyol Process and the Synthesis of ζ Intermetallic Compound Ag5Sn0.9

et al. 2022

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The present work concerns the intermetallic compound (IMC) existing in the Ag–Sn system and its potential use in electronics as attachment materials allowing the adhesion of the chip to the substrate forming the power module. First, we present the synthesis protocol in polyol medium of a compound with the chemical formula Ag5Sn0.9 belonging to the solid solution of composition located between 9 and 16 at.% Sn, known as solid solution ζ (or ζ-Ag4Sn). This phase corresponds to the peritectic invariant point at 724 °C. Differential thermal analysis and X-ray dispersive analysis confirm the single-phased (monocrystalline) nature of the Ag5Sn0.9 powder issued after synthesis. Scanning electron microscopy shows that Ag5Sn0.9 particles are spherical, and range in submicronic size of around 0.18 μm. X-ray diffraction analysis reveals that the ζ phase mostly exists under the two allotropic varieties (orthorhombic symmetry and hexagonal symmetry) with however a slight excess of the hexagonal variety (60% for the hexagonal variety and 40% for the orthorhombic variety). The lattice parameters resulting from this study for the two allotropic varieties are in good agreement with the Hume-Rothery rules.

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“…Among them, the most promising one is undoubtedly the Sn-Ag-Cu ternary alloy, which has advantages of good wetting property, superior interfacial properties, high creep resistance, low coarsening rate, and so on [2]. Recently, much research about the effect of the Ag content on several properties except thermal properties for a fixed Cu content in the Sn-Ag-Cu alloy have been performed [3][4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Thermophysical Properties of Sn–Ag–Cu Based Pb-Free Solders

et al. 2009

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Lead-tin (Pb-Sn) alloys are the dominant solders used for electronic packaging because of their low cost and superior properties required for interconnecting electronic components. However, increasing environmental and health concerns over the toxicity of lead, combined with global legislation to limit the use of Pb in manufactured products, have led to extensive research and development studies of lead-free solders. The Sn-Ag-Cu ternary eutectic alloy is considered to be one of the promising alternatives. Except for thermal properties, much research on several properties of Sn-Ag-Cu alloy has been performed. In this study, five Sn-xAg-0.5Cu alloys with variations of Ag content x of 1.0 mass%, 2.5 mass%, 3.0 mass%, 3.5 mass%, and 4.0 mass% were prepared, and their thermal diffusivity and specific heat were measured from room temperature to 150 • C, and the thermal conductivity was calculated using the measured thermal diffusivity, specific heat, and density values. Also, the linear thermal expansion was measured from room temperature to 170 • C. The results show that Sn-3.5Ag-0.5Cu is the best candidate because it has a maximum thermal

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The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder

Cited by 20 publications

References 16 publications

Investigation on reliability of low-Ag lead-free solder alloy

Investigation on reliability of low-Ag lead-free solder alloy

The Polyol Process and the Synthesis of ζ Intermetallic Compound Ag5Sn0.9

Thermophysical Properties of Sn–Ag–Cu Based Pb-Free Solders

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