2016
DOI: 10.1039/c6ra02227h
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The effect of 2-mercaptobenzothiazole on laser-assisted electroless copper plating

Abstract: Copper coatings on PET substrates (conductive treatment through laser direct structuring) were prepared from an electroless plating bath. The coatings' morphology and the plating rate were shown in the figure at various concentrations of 2-MBT.

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Cited by 5 publications
(4 citation statements)
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References 19 publications
(18 reference statements)
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“…Thus, the more positive potential found with MBT may reflect the initial condition before formaldehyde addition and the more positive mixed potential in the case of MBT. 7,42 Baths containing MBT and Ni exhibit potentials slightly lower than that of MBT alone. The final potentials obtained in this measurement were utilized in subsequent chronoamperometric experiments.…”
Section: Resultsmentioning
confidence: 99%
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“…Thus, the more positive potential found with MBT may reflect the initial condition before formaldehyde addition and the more positive mixed potential in the case of MBT. 7,42 Baths containing MBT and Ni exhibit potentials slightly lower than that of MBT alone. The final potentials obtained in this measurement were utilized in subsequent chronoamperometric experiments.…”
Section: Resultsmentioning
confidence: 99%
“…−0.65 to −0.8 V. 11,61,62 Thiols have a very high affinity for Cu so the changes in the work function of Cu with the inclusion of Ni has a negligible effect on MBT adsorption. 42 The presence of MBT on the Cu electrode has a dramatic effect on the Cu deposition rate. The origin of the effect is likely site blockage by the MBT additive.…”
Section: Discussionmentioning
confidence: 99%
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“…When palladium chloride solution is dipping in, the palladium chloride may be reduced to metallic palladium (Pd 0 ) and bound to the desired surface. Moreover, the concentration of palladium and stannous is normally 5 × 10 −6 g/cm 2 and 20 × 10 −6 g/cm 2 respectively, which usually is used for plating of plastics [ 286 , 287 , 288 , 289 ].…”
Section: Electroless Plating Proceduresmentioning
confidence: 99%