Effect of Ni on Electroless Cu Plating Rates in the Presence of 2,2′-Bipyridyl and 2-Mercaptobenzothiazole
Gavin S. Lindsay,
Dirk Rohde,
Tobias Bernhard
et al.
Abstract:Electrochemical measurements and Surface Enhanced Raman Spectroscopy (SERS) are used to evaluate the effect of Ni addition on the rate of Cu electroless deposition in the presence of 2,2′-bipyridyl (BP) and 2-mercaptobenzothiazole (MBT). Ni addition is found to increase the rate of electroless Cu deposition in the presence of BP but had no effect on the rate in the presence of MBT. In situ SERS obtained at the potential of electroless deposition shows that BP is destabilized from the Cu surface in the presence… Show more
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