The determination of phases formed in AlSiCu/TiN/Ti contact metallization structure of integrated circuits by x-ray diffraction

Fortin, Vincent; Gagnon, G.; Caron, Mario; Gujrathi, S. C.; Currie, J. F.; Ouellet, L.; Tremblay, Yves; Biberger, M.

doi:10.1063/1.366710

Journal of Applied Physics

1998

DOI: 10.1063/1.366710

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The determination of phases formed in AlSiCu/TiN/Ti contact metallization structure of integrated circuits by x-ray diffraction

Vincent Fortin

G. Gagnon

Mario Caron

et al.

Abstract: Effect of water absorption of dielectric underlayers on crystal orientation in Al-Si-Cu/Ti/TiN/Ti metallization

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Cited by 4 publications

References 30 publications

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Interfacial reaction of intermetallic compounds of ultrasonic-assisted brazed joints between dissimilar alloys of Ti 6Al 4V and Al 4Cu 1Mg

Zhao

Yan

et al. 2011

Ultrasonics Sonochemistry

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Ultrasonic-assisted brazing of Al4Cu1Mg and Ti6Al4V using Zn-based filler metal (without and with Si) has been investigated. Before brazing, the Ti6Al4V samples were pre-treated by hot-dip aluminizing and ultrasonic dipping in a molten filler metal bath in order to control the formation of intermetallic compounds between the Ti6Al4V samples and the filler metal. The results show that the TiAl(3) phase was formed in the interface between the Ti6Al4V substrate and the aluminized coating. For the Zn-based filler metal without Si, the Ti6Al4V interfacial area of the brazed joint did not change under the effect of the ultrasonic wave, and only consisted of the TiAl(3) phase. For the Zn-based filler metal with Si, the TiAl(3) phase disappeared and a Ti(7)Al(5)Si(12) phase was formed at the interfacial area of the brazed joints under the effect of the ultrasonic wave. Due to the TiAl(3) phase completely changing to a Ti(7)Al(5)Si(12) phase, the morphology of the intermetallic compounds changed from a block-like shape into a lamellar-like structure. The highest shear strength of 138MPa was obtained from the brazed joint free of the block-like TiAl(3) phase.

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Interfacial reaction of intermetallic compounds of ultrasonic-assisted brazed joints between dissimilar alloys of Ti 6Al 4V and Al 4Cu 1Mg

Zhao

Yan

et al. 2011

Ultrasonics Sonochemistry

View full text Add to dashboard Cite

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Effects of stress and electric field on the electromechanical properties of Pb(Mg1∕3Nb2∕3)O3–0.32PbTiO3 single crystals

Wan

Chen

Shen

2005

Journal of Applied Physics

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The effects of constant bias stress and electric field on the electromechanical behavior of ⟨001⟩-oriented Pb(Mg1∕3Nb2∕3)O3–0.32PbTiO3 (PMN–0.32PT) relaxor ferroelectric single crystals have been investigated. Both unipolar and bipolar responses are considered. Obtained results show that compressive bias stress with appropriate magnitude can significantly increase the piezoelectric constant. It is also found that bias electric field in the poling direction stabilizes the microstructure of PMN–0.32PT and reduces the hysteresis loss. The observed effects of bias stress and bias electric field on the electromechanical properties of ⟨001⟩-oriented PMN–0.32PT single crystals can be interpreted in terms of phase-transformation-induced polarization rotation through intermediate phases.

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Thermal Annealing Effect on Elastic-Plastic Behavior of Al-Si-Cu Structural Films Under Uniaxial and Biaxial Tension

Namazu

Fujii

et al. 2013

J. Microelectromech. Syst.

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The determination of phases formed in AlSiCu/TiN/Ti contact metallization structure of integrated circuits by x-ray diffraction

Abstract: Effect of water absorption of dielectric underlayers on crystal orientation in Al-Si-Cu/Ti/TiN/Ti metallization

Cited by 4 publications

References 30 publications

Interfacial reaction of intermetallic compounds of ultrasonic-assisted brazed joints between dissimilar alloys of Ti 6Al 4V and Al 4Cu 1Mg

Interfacial reaction of intermetallic compounds of ultrasonic-assisted brazed joints between dissimilar alloys of Ti 6Al 4V and Al 4Cu 1Mg

Effects of stress and electric field on the electromechanical properties of Pb(Mg1∕3Nb2∕3)O3–0.32PbTiO3 single crystals

Thermal Annealing Effect on Elastic-Plastic Behavior of Al-Si-Cu Structural Films Under Uniaxial and Biaxial Tension

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