The creep properties of lead-free solder joints

Song, Ho Geon; Morris, J. W.; Hua, Fay

doi:10.1007/bf02701846

Cited by 98 publications

(41 citation statements)

References 12 publications

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“…(1) and the value is ranging from 52 to 115 kJ/mol. 46,47) Therefore, the observed value of Q for the solder alloy is essentially same with the other researchers and, thus, the creep data shown in Fig. 13 are reliable.…”

supporting

confidence: 85%

Applicability of an Exponential Law in Creep of Metals

2003

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An exponential type creep equation has been developed for heat resistant steels by the authors. This equation was induced assuming both a thermally activated process for a mobile dislocation and rather high applied stress. The applicability of the new creep equation was examined for a pure iron, two kinds of Ni-base super alloys and an eutectic solder alloy in a Pb-Sn system which were tested at relatively high temperatures and under very low stresses. All of the data obtained were completely explained by the new creep equation. The data for each alloy were classified into a few groups, where a deformation mechanism may be different with each other. The new creep equation is valid for stresses higher than the half value of the slope in a logarithm of time to rupture vs. linear stress diagram.

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supporting

confidence: 85%

Applicability of an Exponential Law in Creep of Metals

2003

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“…Therefore, a number of studies on mechanical fatigue of solder alloys to understand fatigue failure of solder joints have been performed to date. In general, mechanical properties of solder alloys such as creep and fatigue are measured using larger volume bulk specimens than real solder joints [1][2][3][4][5] as there are many difficulties in sample preparation and mechanical testing. However, the microstructure of the real joint is totally different to that of the large size mechanical testing specimen, since solidification conditions of real joints cannot be duplicated in large size.…”

Section: Introductionmentioning

confidence: 99%

Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen

et al. 2005

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Micro-bulk fatigue testing developed to investigate the fatigue lives and damage mechanisms of Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys. The fatigue life of micro-bulk solder obeyed Manson-Coffin's empirical law, and the fatigue ductility exponents were about 0.5 for both Sn-Ag-Cu and Sn-Pb alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 times longer than that of Sn-37Pb alloy under symmetrical cycling at 298 K, although fatigue resistance of Sn-3.0Ag-0.5Cu alloy was not very superior under asymmetrical wave and elevated temperature condition. The fatigue crack was developed from extrusion and intrusion of slip band in Sn-3.0Ag-0.5Cu alloy, while the crack was observed at colony boundary and grain boundary in Sn-37Pb alloy. The difference in damage mechanism may affect the susceptibility to fatigue life test condition of reversibility.

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“…This value of the activation energy is slightly below the most widely cited activation energy for the creep of SAC 305, which is a bit over 100 kJ/mole, 4,7,8 but is well inside the range of measured values, $60 kJ/mole to $110 kJ/mole. Given the natural scatter in creep rates, and the very limited data available here, the computed activation energy seems reasonable, and suggests that at least most of the physics of the phenomenon are captured in Eqs.…”

Section: The Influence Of Current On Creep Rate At Equivalent Temperamentioning

confidence: 40%

The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects

Kinney

Lee

Liu

et al. 2009

Journal of Elec Materi

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The work reported here concerns the effect of an imposed current on the creep of simple Sn-Ag-Cu interconnects. The samples employed were double-shear specimens that contained paired solder joints, 400 lm 9 400 lm in crosssection, 200 lm in thickness, on Cu. Different representative microstructures were prepared by electromigration and isothermal aging. Samples were tested with and without an imposed current, and at a variety of temperatures. These tests consistently yield two unexpected results. First, the relative increase in creep rate with current was nearly the same over a range of temperatures and variety of starting microstructures. Second, when tests were done at the same temperature (including the effect of Joule heating), the rate of creep was lower under imposed current than under isothermal conditions. These results are explained in the light of new data that show that the temperature within the joint is almost constant, even under a relatively high current density of 5500 A/cm 2 . Given constant temperature and a microstructure that includes interfacial voids, the current depletes the joint of vacancies, lowering the average creep rate, and introducing observable heterogeneities in the creep pattern. The usual Dorn equation then provides a very useful basis for evaluating the change of creep rate with current.

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The creep properties of lead-free solder joints

Cited by 98 publications

References 12 publications

Applicability of an Exponential Law in Creep of Metals

Applicability of an Exponential Law in Creep of Metals

Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen

The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects

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The creep properties of lead-free solder joints

Cited by 98 publications

References 12 publications

Applicability of an Exponential Law in Creep of Metals

Applicability of an Exponential Law in Creep of Metals

Isothermal Fatigue Properties of Sn&ndash;Ag&ndash;Cu Alloy Evaluated by Micro Size Specimen

The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects

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Product

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Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen