2003
DOI: 10.1016/s0168-9002(03)01749-2
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The BTeV silicon pixel and microstrip detectors

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Cited by 5 publications
(2 citation statements)
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“…In the hybrid pixel technique sensor and FE-chips are separate parts of the detector module connected by small conducting bumps applied by using the bumping and flip-chip technology. All LHC-collider-detectors [1], [2], [3] ALICE, ATLAS, and CMS, LHCb for the RICH system [4], as well as some fixed target experiments (NA60 [5] at CERN and BTeV [6] at Fermilab) employ the hybrid pixel technique to build large scale (∼m 2 ) pixel detectors. Pixel area sizes are typically 50µm ×400µm as for ATLAS or 100µm ×150µm as for CMS.…”
Section: Hybrid Pixels: the State Of The Art In Pixel Detector Tementioning
confidence: 99%
“…In the hybrid pixel technique sensor and FE-chips are separate parts of the detector module connected by small conducting bumps applied by using the bumping and flip-chip technology. All LHC-collider-detectors [1], [2], [3] ALICE, ATLAS, and CMS, LHCb for the RICH system [4], as well as some fixed target experiments (NA60 [5] at CERN and BTeV [6] at Fermilab) employ the hybrid pixel technique to build large scale (∼m 2 ) pixel detectors. Pixel area sizes are typically 50µm ×400µm as for ATLAS or 100µm ×150µm as for CMS.…”
Section: Hybrid Pixels: the State Of The Art In Pixel Detector Tementioning
confidence: 99%
“…This technique is the only one which at present is robust and mature enough to cope with the above demands. All LHC-collider-detectors ALICE [1,2], ATLAS [3,4], and CMS [5,6], LHCb (for the RICH system) [7] at the LHC, BTeV [8] at the TEVATRON and the CERN fixed target experiment NA60 [9,10], employ the hybrid pixel technique to build large scale (up to ∼2m 2 ) pixel detectors. Pixel area sizes are typically 50µm × 400µm as for ATLAS or 100µm × 150 µm as for CMS.…”
mentioning
confidence: 99%