The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints

Abstract

In recent years, package downsizing has become one of biggest trends in packaging technologies because of miniaturization and the high integration of electronic devices. As a result, the reliability of fatigue life has been prioritized as an important concern, since the thermal expansion difference between a package and printed circuit board causes thermal fatigue. But, the reliability of thermal fatigue life may be lowered by the dispersion of design factors such as the dimensions, shapes, and material properties of package systems. Also, the fracture modes (fatigue fracture, brittle destruction in the interface, and compound destruction, and so on) will be affected by these dispersion factors. Although this dispersion should be reduced in order to improve the reliability, reducing all dispersion is inefficient and time-consuming. So, the factors that greatly contribute to thermal fatigue life have to be reduced. In this study, evaluations of the influence of various design factors on the reliability of soldered joints of a BGA (Ball Grid Array) were carried out, and got each influence. With the results, design engineers can rate each factor’s effect on reliability and assess the reliability of their design beginning at the concept design stage. Consequently, it will be possible to avoid almost all reliability problems from the beginning. Also, by rating the factors, the design period can be shortened

New reliability assessment method for solder joints in BGA package by considering the interaction between design factors

“…And the mismatch in shear direction between the component and PCB tends to decrease when the package warps upwards as shown in Fig. 7 [15]. Therefore, it is clarified that the warpage of package has a large influence to the reliability.…”

Evaluation technique for the failure life scatter of lead-free solder joints in electronic device

“…In this study, how the dispersion of design factors influences the fatigue life in lead-free solder joint is investigated by the analytical approach. At first, sensitivity analyses are carried out to study the main effect of the dispersion of each factor on solder joints [10]. And then, the interacting effect between the factors on the reliability is studied by considering the structural asymmetry due to the unbalanced solder joints.…”