The application of chemical–mechanical polishing for planarizing a SU-8/permalloy combination used in MEMS devices

Kourouklis, C.; Kohlmeier, T.; Gatzen, H.H.

doi:10.1016/s0924-4247(03)00180-8

Cited by 33 publications

(18 citation statements)

References 8 publications

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“…Planarization is necessary in multi-layer processes [38], and micromachining was adopted to improve the surface quality, and give control over the layer thickness. As hybrid systems are typically used for porous structures with metal/ceramic nanoparticles, mechanical planarization processes are suitable for inorganic materials.…”

Section: Process Configuration Overviewmentioning

confidence: 99%

Hybrid 3D printing by bridging micro/nano processes

Yoon

Jang

Kim

et al. 2017

J. Micromech. Microeng.

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The aim of this work was to develop a novel hybrid manufacturing method for nanoscale three-dimensional (3D) printing with multi-material capabilities. 3D structuring methods at the micro/nanoscale are major goals of various engineering fields, and much work has been carried out to improve the minimum feature size, geometrical complexity, and material selection. With the aim of nanoscale multimaterial printing, a hybrid process was reported with an integrated nanoparticle deposition system (NPDS) and focused ion beam (FIB) system; however this process has limitations in terms of surface roughness and control over the layer thickness, as well as with the process scale, and furthermore, lack of sacrificial layers.In this dissertation, a novel hybrid process is described, which combines aerodynamically focused nanoparticle (AFN) printing, micro-machining and focused ion beam (FIB) milling. AFN printing is based on NPDS, and micromachining was used for local planarization. In addition to these processes, spincoating was used to fabricate sacrificial layers. By bridging these different II micro/nanoscale processes, the resulting hybrid process can address the limitations of the individual processes.To create the hybrid process, each process was investigated to enable compatibility. With the AFN printing system, the surface morphology of a detached substrate was observed, and the bonding mechanism between the substrate and nanoparticles was investigated. A novel printing strategy was identified to reduce the scale of the process. With the micro-machining system, different tool geometries were investigated. Complex geometries inspired by conventional-scale tools were implemented on the micro-scale, and their effects were investigated. With the FIB system, material re-deposition phenomena were investigated to reduce defects that occur during ion sputtering. A novel path-generation strategy was identified and investigated for different scanning paths.Process capability is discussed using fabrication examples and functional applications. The novel hybrid process represents a significant advance in the state of the art, and enables far improved process scales or dimensional degree of freedom, without losing the advantages of broad choice of materials.3D-pinted micro bi-material cantilevers were fabricated as a thermal actuator.The mechanical and thermal properties of the structure were investigated using an in-situ measurement system, and irregular thermal phenomena were analyzed. It is expected that these in-situ measurements of the 3D printed microstructure will contribute to materials research.Various 3D structures can be fabricated using the process described here from a range of metal/ceramic inorganic materials, including polymers. In particular, it is expected that the process will contribute to the area of customized nanoscale structuring, with potential applications in medical treatments. It is also expected that this work will contribute to further improvements in manufacturing technology by combining different m...

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Section: Process Configuration Overviewmentioning

confidence: 99%

Hybrid 3D printing by bridging micro/nano processes

Yoon

Jang

Kim

et al. 2017

J. Micromech. Microeng.

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“…If possible, resist molds were only filled to about 60-70% of their height to avoid current concentration effects at the resist surface. Otherwise, for instance, when a complete filling of permanent SU-8 structures is required, mechanical planarization of the resist/metal surface was applied using CMP, resulting in precise features (Kourouklis et al, 2002).…”

Section: Electroplatingmentioning

confidence: 99%

An investigation on technologies to fabricate microcoils for miniaturized actuator systems

Kohlmeier¹,

Seidemann

Büttgenbach

et al. 2004

Microsystem Technologies

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Within the framework of the Collaborate Research Center ''Design and Fabrication of Active Microsystems'' (Sonderforschungsbereich 516), one aspect is the development of fabrication technology for driving coil systems to be applied to in electromagnetic microactuators. The two key focus areas are the fabrication of high aspect ratio conductors and insulating them by applying planarizing polymer material. The research activities included the development of technologies like for UV depth lithography, electroplating through lithographic masks (galvanoforming), as well as embedding in and planarization by insulation material. Combining these technologies allows to create high aspect ratio integrated multilayer coils with integrated magnetic flux guiding structures. The materials applied were copper as a conductor, NiFe for magnetic cores and the negative tone resists SU-8 (MicroChem Corp.) as well as BCB (DOW Chemical) for insulation and embedding purposes. For electroplating molds, the DNQ/Novolak type photoresists AZ4562 and AZ9260 (Clariant) were utilized. The established technologies were integrated into process flows for fabricating thick and high aspect ratio planar and helical coils for electromagnetic linear actuators.

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“…An exception represents the description of a first CMP process which was already developed for and applied on MEMS based on multi-layer structures featuring soft magnetic cores (NiFe alloys) and excitation coils [11,21]. But an optimized and more efficient CMP process for these materials, which can be a crucial drive for improving functionality, decreasing dimensions, and extending the application field of magnetic MEMS has not been developed yet.…”

Section: Introductionmentioning

confidence: 99%