Texture development in Cu-Ag-Fe triphase immiscible nanocomposites with superior thermal stability

Niu, Tongjun; Zhang, Yifan; He, Zeqiang; Ricther, Nicholas A.; Wang, Haiyan; Zhang, Xinghang

doi:10.1016/j.actamat.2022.118545

Cited by 7 publications

(1 citation statement)

References 102 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Metallic multilayers refer to thin films and coatings composed of alternating layers of two of more different metals. In contrast to their bulk counterparts, metallic multilayers offer some extraordinary properties, including but not limited to superior mechanical strength (e.g., up to ½ of the theoretical strength), high corrosion and radiation resistance, and enhanced thermal stability [1][2][3][4]. The remarkable mechanical strength observed in metallic multilayers can be attributed to a combination of factors such as layer thickness [5], interface structure [6], deposition temperature [7], and thermal annealing conditions [8,9].…”

Section: Introductionmentioning

confidence: 99%

Mechanical Properties of Thermally Annealed Cu/Ni and Cu/Al Multilayer Thin Films: Solid Solution vs. Intermetallic Strengthening

Zhou,

Wang

2024

Metals

View full text Add to dashboard Cite

In this study, Cu/Ni and Cu/Al multilayers, with individual layer thickness varying from 25 nm to 200 nm, and co-sputtered Cu-Ni and Cu-Al single layer films were deposited at room temperature via magnetron sputtering and further annealed from 100 °C to 300 °C. The mechanical and microstructural properties of the as-deposited and annealed samples were characterized by nanoindentation, x-ray diffraction, and scanning electron microscopy. Both multilayer systems exhibit an increase in hardness with increasing annealing temperature. However, the Cu/Ni system shows a gradual and moderate hardness increase (up to 30%) from room temperature to 300 °C, while the Cu/Al system displays a sharp hardness surge (~150%) between 125 °C and 200 °C. The co-sputtered Cu-Ni and Cu-Al samples consistently demonstrate higher hardness than their multilayered counterparts, albeit with distinctly different temperature dependence—the hardness of Cu-Ni increases with annealing temperature while Cu-Al maintains a constant high hardness throughout the entire temperature range. The distinct thermal strengthening mechanisms observed in the two metallic multilayer systems can be ascribed to the formation of solid solutions in Cu/Ni and the precipitation of intermetallic phases in Cu/Al. This study highlights the unique advantage of intermetallic strengthening in metallic multilayer systems.

show abstract