Mechanical Properties of Thermally Annealed Cu/Ni and Cu/Al Multilayer Thin Films: Solid Solution vs. Intermetallic Strengthening
Yang Zhou,
Junlan Wang
Abstract:In this study, Cu/Ni and Cu/Al multilayers, with individual layer thickness varying from 25 nm to 200 nm, and co-sputtered Cu-Ni and Cu-Al single layer films were deposited at room temperature via magnetron sputtering and further annealed from 100 °C to 300 °C. The mechanical and microstructural properties of the as-deposited and annealed samples were characterized by nanoindentation, x-ray diffraction, and scanning electron microscopy. Both multilayer systems exhibit an increase in hardness with increasing an… Show more
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