Texture and Mechanical Properties of Al–Mg Alloy with Unimodal and Bimodal Grain-Structures Formed by Accumulative Roll Bonding and Annealing

Abstract

The structural and mechanical properties of a commercial A5052 aluminummagnesium alloy processed by accumulative roll bonding (ARB) and subsequent annealing were investigated. Unimodal and bimodal grain-structures were formed in the ARB-processed specimens by annealing at 250°C and 300°C, respectively. In the specimen ARB-processed and annealed at 300°C, {001} ©100ª cube orientation became the main texture component which corresponded to coarse recrystallized grains in the bimodal grain-structures. The preferential formation of the cube texture could be explained by existing theories regarding stored energy and grain boundary mobility. High strength and high ductility was both managed in the specimens with bimodal grain-structures as well as those with unimodal grain-structures. In order to achieve both high strength and high ductility in bimodal grain-structures, the area fraction of coarse grains to fine grains played a critical role. It was also suggested in this study that bimodal structures were not only the structure to provide the coexistence of high strength and high ductility.

Enhanced Ductility of High-Strength Ultrafine-Grained Aluminum Alloys at Ambient Temperature (Review)

“…It was shown in Ref. [37], that after 7 cycles of accumulative roll bonding (ARB) at RT and annealing at a temperature of 300 °C for 30 min, a bimodal structure is formed in samples of the AA5052 alloy. As a result, the ductility after annealing significantly increased (δ ~ 16%), however the strength, although it exceeded the values in the state before ARB processing, decreased by more than two times ( ~260 UTS σ MPa).…”

Revealing the local fatigue behavior of bimodal copper laminates by micropillar fatigue tests

“…equal channel angular pressing (ECAP), in combination with a heat treatment [10][11][12]. A layered structure with clearly defined layers of UFG and CG grains can be deposited in an electrolyte bath via pulsed electrodeposition (PED) [5,13] or can be manufactured by accumulative roll bonding (ARB) [14][15][16][17]. Even if the grain size distributions and arrangement of the UFG and CG domains of the above mentioned processes could be similar, the resulting materials are still in a different state of deformation.…”