Revealing the local fatigue behavior of bimodal copper laminates by micropillar fatigue tests

Krauß, Sebastian; Schieß, Thomas; Göken, Mathias; Merle, Benoit

doi:10.1016/j.msea.2020.139502

Cited by 8 publications

(3 citation statements)

References 36 publications

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“…Thanks to intense developments in micromechanical testing in the past decade, high and low temperature micropillar compression are now available [49,50]. Also cyclic/fatigue behaviour at the micronscale can be investigated thanks to high frequency micromechanical tests [51].…”

Section: Resultsmentioning

confidence: 99%

Multi-scale in-situ micro-mechanical characterization of Polymer Core Solder Ball (PCSB) coatings for BGA interconnections

Malkorra,

Sao-Joao,

Costa

et al. 2023

Microelectronics Reliability

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Section: Resultsmentioning

confidence: 99%

Multi-scale in-situ micro-mechanical characterization of Polymer Core Solder Ball (PCSB) coatings for BGA interconnections

Malkorra,

Sao-Joao,

Costa

et al. 2023

Microelectronics Reliability

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“…Cyclic compression of pillars with dynamic modulus measurements (123) was used to study the fatigue behavior of copper with a bimodal distribution of grains (∼200 versus 2,000 nm) in laminate form (124). Such grain size distributions are known to generate high ductility as well as high strength in monotonic tests in the nano/microcrystalline regime.…”

Section: Plasticity In Polyphase Alloysmentioning

confidence: 99%

Small-Scale Mechanical Testing

Jayaram

2022

Annu. Rev. Mater. Res.

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This article reviews recent developments in small-scale mechanical property testing with some emphasis on intermediate (meso) length scales in complex microstructures and coated systems. The introduction summarizes size effects discovered from a century ago up to the recent explosion in micropillar testing that established many length scale effects in yielding and fracture. The bulk of the article deals with plasticity and fracture in polyphasic and microstructurally graded systems, including biomaterials, composites, and thermal protection systems, highlighting the use of in situ methods where mechanical tests are coupled to synchrotron X-ray scattering, electron backscattering, radiation damage, and digital image correlation. Expected final online publication date for the Annual Review of Materials Research, Volume 52 is July 2022. Please see http://www.annualreviews.org/page/journal/pubdates for revised estimates.

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“…Some high cycle fatigue (HCF) studies at microscale has been carried out using continuous stiffness measurement (CSM) [21] technique, which involves the superposition of a small sinusoidal displacement during deformation. Merle et al [22] used micropillar compression with 40 Hz CSM to perform HCF testing of ECAP copper to 3 × 10 6 cycles, and a similar study was conducted on bimodal copper laminates by Krauß et al [23]. However, for micropillar compression the load cycling is fully compressive, which does not necessarily translate to real conditions.…”

Section: Introductionmentioning

confidence: 99%

Cyclic Deformation of Microcantilevers Using In-Situ Micromanipulation

Iyer

Colliander

2021

Exp Mech

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Background The trend in miniaturisation of structural components and continuous development of more advanced crystal plasticity models point towards the need for understanding cyclic properties of engineering materials at the microscale. Though the technology of focused ion beam milling enables the preparation of micron-sized samples for mechanical testing using nanoindenters, much of the focus has been on monotonic testing since the limited 1D motion of nanoindenters imposes restrictions on both sample preparation and cyclic testing. Objective/Methods In this work, we present an approach for cyclic microcantilever bending using a micromanipulator setup having three degrees of freedom, thereby offering more flexibility. Results The method has been demonstrated and validated by cyclic bending of Alloy 718plus microcantilevers prepared on a bulk specimen. The experiments reveal that this method is reliable and produces results that are comparable to a nanoindenter setup. Conclusions Due to the flexibility of the method, it offers straightforward testing of cantilevers manufactured at arbitrary position on bulk samples with fully reversed plastic deformation. Specific microstructural features, e.g., selected orientations, grain boundaries, phase boundaries etc., can therefore be easily targeted.

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Revealing the local fatigue behavior of bimodal copper laminates by micropillar fatigue tests

Cited by 8 publications

References 36 publications

Multi-scale in-situ micro-mechanical characterization of Polymer Core Solder Ball (PCSB) coatings for BGA interconnections

Multi-scale in-situ micro-mechanical characterization of Polymer Core Solder Ball (PCSB) coatings for BGA interconnections

Small-Scale Mechanical Testing

Cyclic Deformation of Microcantilevers Using In-Situ Micromanipulation

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