2021
DOI: 10.1016/j.nima.2021.165396
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Test-beam characterisation of the CLICTD technology demonstrator - A small collection electrode high-resistivity CMOS pixel sensor with simultaneous time and energy measurement

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Cited by 6 publications
(22 citation statements)
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“…The output of the eight sub-pixels are combined by an OR gate in a common digital front-end of the detection channel, allowing for a reduction of the digital logic. The CLICTD sensor features simultaneous 8-bit Time-of-Arrival (ToA) (10 ns ToA bins) and 5-bit Timeover-Threshold (ToT) measurement capabilities, although these are not studied in this paper (see [9] for further details).…”
Section: Sensor Designmentioning
confidence: 99%
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“…The output of the eight sub-pixels are combined by an OR gate in a common digital front-end of the detection channel, allowing for a reduction of the digital logic. The CLICTD sensor features simultaneous 8-bit Time-of-Arrival (ToA) (10 ns ToA bins) and 5-bit Timeover-Threshold (ToT) measurement capabilities, although these are not studied in this paper (see [9] for further details).…”
Section: Sensor Designmentioning
confidence: 99%
“…In the following sections the transient Monte Carlo simulation using electrostatic TCAD fields and Allpix 2 is compared to data recorded with the CLICTD prototype in test-beam measurements. This section summarises the reconstruction and analysis techniques, while a detailed description of the setup and reconstruction is given elsewhere both for the test-beam measurements [9] and for the simulations [2].…”
Section: Reconstruction and Analysismentioning
confidence: 99%
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“…The following section gives a brief overview of the main features of the CLICTD sensor. Additional details can be found in [5] and [9].…”
Section: The Clictd Sensormentioning
confidence: 99%
“…Monolithic sensor designs featuring a small collection electrode benefit from a reduced capacitance, which enables an improvement in signal-to-noise ratio and reduced power consumption [1]. Several sensors have been fabricated in a modified 180 nm CMOS imaging process implementing the small collection-electrode design with a 25 -30 µm highresistivity epitaxial layer on a low-resistivity substrate, such as the ALPIDE [2], (Mini-)MALTA [3], FASTPix [4] and CLICTD [5] sensors. They have exhibited promising results regarding radiation tolerance, a time resolution down to hundreds of picoseconds, a spatial resolution of a few micrometers and full efficiency over a wide threshold range.…”
Section: Introductionmentioning
confidence: 99%