Tensile properties of copper-nickel fine clad prepared by surface activation bonding and subsequent heat treatment

Jung, Taek Kyun; Kim, Kyung-Hoon; Joh, Dong-Woo; Heo, Kyuyoung; Lee, Hyo-Soo; Lim, Sung‐Chul; Kwon, Hyouk-Chon

doi:10.1007/s13391-013-6005-7

Cited by 4 publications

(2 citation statements)

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“…Overall, the strain rate has little effect on the strength of pure Cu and Ni sheets in tensile tests at room temperature. Compared with single-layer metal sheets, the Cu/Ni clad foils have a unique interface layer [29]. The interface layer dramatically influences the mechanical properties, plastic deformation, and fracture behavior of clad foils.…”

Section: Discussionmentioning

confidence: 99%

“…The interface layer dramatically influences the mechanical properties, plastic deformation, and fracture behavior of clad foils. Yield strength of the clad foils is influenced by the properties and thickness of the interface layer [29] and nanoscale interfacial layers greatly improve the strength of compound foils by limiting dislocation motion [30]. The strain gradient induced by the Cu/Ni interface may introduce a high density of GND, which retards the plastic instability along the thickness direction, and better interfacial adhesion facilitates the co-deformation ability of adjacent components to achieve co-necking [31].…”

Section: Discussionmentioning

confidence: 99%

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Effect of Strain Rate on the Mechanical Properties of Cu/Ni Clad Foils

Wang

Zhang

et al. 2021

Materials

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The performance of clad foils in microforming deserves to be studied extensively, where the strain rate sensitivity of the clad foil concerning the forming performance is a crucial factor. In this paper, the strain rate sensitivity of the mechanical properties of coarse-grained (CG) Cu/Ni clad foils in the quasi-static strain rate range (ε˙=10−4 s−1~10−1 s−1) is explored by uniaxial tensile tests under different strain rates. The results show that the strength and ductility increase with strain rate, and the strain rate sensitivity m value is in the range of 0.012~0.015, which is three times the value of m for CG pure Cu. The fracture morphology shows that slip bands with different directions are entangled in localized areas near the interface layer. Molecular dynamics simulations demonstrate the formation of many edged dislocations at the Cu/Ni clad foils interface due to a mismatch interface. The improved ductility and strain rate sensitivity is attributed to the interaction and plugging of the edged dislocations with high density in the interface layer. Additionally, the influence of size effect on mechanical properties is consistently present in the quasi-static strain rate range. This paper helps to understand the strain rate sensitivity of CG clad foils and to develop clad foils in microforming processes.

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Section: Discussionmentioning

confidence: 99%