Interactive effects of microstructure and interface on tensile deformation behaviors of Cu/Ni clad foils

Molecular dynamics studies of the effect of intermediate Fe layer thickness on the enhanced strength and ductility of Cu/Fe/Ni multilayer

“…Where, red, green and gray atoms represent HCP structure, FCC structure and disorder structure, as well as the lines with different colors represent dislocations of different Burgers vectors, respectively. As can be seen from figure 3(a), the plastic deformation is triggered by slipping of Shockley partial dislocations from semi-coherent interface into Cu layer, which is consistent with the experimental observation [17]. We carefully analyzed its nucleation and slip processes, and found that the slipping partial dislocations originate from the decomposition of perfect dislocation at nodes of periodic triangle on interface with dislocation energy reduced by 1/3.…”

“…Wang et al [16] investigated the mechanical properties of Ni/Cu composites with different thickness ratios, and indicated that tensile strength increases and fracture elongation decreases with increasing thickness ratios, respectively. Wang et al [17] investigated the mechanical properties of Cu/Ni composite under different heat treatments, and indicated that flow stress decreases and ductility changes insignificantly with the increase of annealing temperature. Shen et al [18] studied the mechanical properties of Cu/Ni multilayer prepared by rotating jet electrodeposition, and reported that the highly (111) texture and semi-coherent interface are formed, and the hardness increases with decreasing the modulation period.…”