Tensile and high cycle fatigue test of Al–3% Ti thin films

Park, Jun Hyub; Myung, Man Sik; Kim, Yun Jae

doi:10.1016/j.sna.2008.06.003

Cited by 33 publications

(15 citation statements)

References 15 publications

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“…Park et al [11] have investigated the lifetime of Al-3% Ti thin films. They found that these alloyed thin films have a longer fatigue lifetime than bulk Al at the same stress, but are more fatigue sensitive as the lifetime strongly changes for different stress levels.…”

Section: Fatigue In Thin Filmsmentioning

confidence: 99%

A novel high-throughput fatigue testing method for metallic thin films

Burger

Eberl

Siegel

et al. 2011

Science and Technology of Advanced Materials

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Thin films are used in a wide variety of computing and communication applications although their fatigue behavior and its dependence on alloying elements are not very well known. In this paper, we present an experimental implementation of a novel high-throughput fatigue testing method for metallic thin films. The methodology uses the fact that the surface strain amplitude of a vibrating cantilever decreases linearly from the fixed end to the free end. Therefore, a thin film attached to a vibrating cantilever will experience a gradient of strain and corresponding stress amplitudes along the cantilever. Each cantilever can be used to extract a lifetime diagram by measuring the fatigue-induced damage front that progresses along the cantilever during up to 10 8 load cycles.

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Section: Fatigue In Thin Filmsmentioning

confidence: 99%

A novel high-throughput fatigue testing method for metallic thin films

Burger

Eberl

Siegel

et al. 2011

Science and Technology of Advanced Materials

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show abstract

“…The resolution of the CCD camera has pixel number of 1600x1200 and the pixel size is 4.4 lm X 4.4 lm [10]. A detailed description about the microtensile-testing machine has been described previously [4,9]. The range and rated output of the loadcell are 500 mN and 0.1 mV/V/g, respectively.…”

Section: Tensile Testmentioning

confidence: 99%

“…In order to obtain the tensile properties of thin film, it is necessary to transform the measured load-displacement curve to the engineering stress-strain curve, as described in Ref. [9].…”

Section: Tensile Testmentioning

confidence: 99%

A study on the fatigue behaviour of electro‐plated NiCo thin film for probe tip applications

Park¹,

Chun

Kim

et al. 2009

Materialwissenschaft Werkst

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In this study, fatigue tests were performed for NiCo alloy which is commonly used in probe tips of test machines of semiconductors. The smooth specimens were fabricated by MEMS process including electro-plating process on a single-side polished 6 inches (100) silicon wafer. The NiCo thin film consists of about 66.2 % Ni and 33.8 % Co. The specimen is 2000 lm long, 9 lm thick and 100 lm wide. The tests were performed using a novel test procedure, a structure of the specimen is easy to manipulate, align and grip a thin-film and a test machine proposed by the authors. The closed-loop feedback control of the magnetic-electric actuator allowed load-controlled and high cycle fatigue tests with 5 Hz frequency, in ambient environment and with a stress ratio of R = 0.1. The fatigue strength coefficient and exponent were 1324 MPa and -0.0558, respectively. In a fatigue test of thin film, it is difficult to perform the fatigue test at R = -1. However, the result of the fatigue test at R = -1 should be required when fatigue life prediction is performed under variable loading. Therefore, in this study, the modified Goodman method, Gerber method and Soderberg method were considered to investigate which method is most reasonable when mean stress is considered.

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“…Regarding challenge (II), IC-fabrication techniques enable easy specimen variations facilitating the processing of the desired microstructure and geometry. A single chip, wafer or other substrate can carry a wide variation of free-standing specimens with geometries spanning the mm to sub-µm range [39][40][41][42][43][44][45][46]. Additional benefits are the simplified handling of a rigid substrate and the direct applicability of results to actual devices that have been processed in the same way.…”

Section: Introductionmentioning

confidence: 99%

On-wafer time-dependent high reproducibility nano-force tensile testing

Bergers¹,

Hoefnagels²,

Geers³

2014

J. Phys. D: Appl. Phys.

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Time-dependent mechanical investigations of on-wafer specimens are of interest for improving the reliability of thin metal film microdevices. This paper presents a novel methodology, addressing key challenges in creep and anelasticity investigations through on-wafer tensile tests, achieving highly reproducible force and specimen deformation measurements and loading states. The methodology consists of a novel approach for precise loading using a pinin-hole gripper and a high-precision specimen alignment system based on three-dimensional image tracking and optical profilometry resulting in angular alignment of <0.1 mrad and near-perfect co-linearity. A compact test system enables in situ tensile tests of on-wafer specimens under light and electron microscopy. Precision force measurement over a range of 0.07 µN to 250 mN is realized based on a simple drift-compensated elastically-hinged load cell with high-precision deflection measurement. The specimen deformation measurement, compensated for drift through image tracking, yields displacement reproducibility of <6 nm. Proof of principle tensile experiments are performed on 5 µm-thick aluminum-alloy thin film specimens, demonstrating reproducible Young's modulus measurement of 72.6 ± 3.7 GPa. Room temperature creep experiments show excellent stability of the force measurement and underline the methodology's high reproducibility and suitability for time-dependent nanoforce tensile testing of on-wafer specimens.

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Tensile and high cycle fatigue test of Al–3% Ti thin films

Cited by 33 publications

References 15 publications

A novel high-throughput fatigue testing method for metallic thin films

A novel high-throughput fatigue testing method for metallic thin films

A study on the fatigue behaviour of electro‐plated NiCo thin film for probe tip applications

On-wafer time-dependent high reproducibility nano-force tensile testing

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